03:07 BST
2023 IMS (San Diego, CA, USA), June 14-15, 2023
The prestigious International Microwave Symposium (IMS 2023) in San Diego once again hosted the IEEE MTT-S Inter-Society Technology Panel (ISTP) program. This program aims to strengthen collaborations and exchange ideas on technologies of interest between the MTT-S and other entities, including the IEEE Societies, councils, and non-IEEE organizations. The panels are organized to facilitate coordinated conversations on emerging applications and future trends, bringing together diverse perspectives and interests. In this dynamic setting, the participants engage in multidisciplinary discussions, exploring the frontiers of research and development across various sectors. The ISTP program serves as a platform where all parties and partners involved can share their enthusiasm and collectively shape the future.
Panel: Tapping Power WIRELESSLY everywhere? Technologies, Standards and Impact in Our Life
Organizer | |||
Alessandra | Costanzo | University of Bologna | Italy |
Naoki | Shinohara | Kyoto University | Japan |
J.-C. | Chiao | Southern Methodist University | USA |
Ke | Wu | Polytechnique Montréal | Canada |
Panelists | |||
Yuji | Tanabe | AETERLINK | Japan |
Minoru | Furukawa | Space Power Technologies | Japan |
Hiroyuki | Tani | Panasonic | Japan |
Charlie | Green | PowerCAST | USA |
Hatem | Zeine | Ossia | USA |
Paul | Mitcheson | Imperial College London | UK |
Jason | Gill | PowerCAST | USA |
Panel: RF/Microwave Packaging and Interconnect Technologies for Global Integration – Are We on the Right Track?
Organizer | |||
Kamal | Samanta | Sony Europe | UK |
Manos | Tentzeris | Georgia Tech | USA |
J.-C. | Chiao | Southern Methodist University | USA |
Ke | Wu | Polytechnique Montréal | Canada |
Panelists | |||
Kevin | Gu | Metawave | USA |
Patrick | Reynaert | KU Leuven and IMEC | Belgium |
Beth | Keser | International Microelectronics Assembly and Packaging Society | USA |
Premjeet | Chahal | National Science Foundation | USA |
Harshpreet | Bakshi | Texas Instruments | USA |
Tim | Lee | The Boeing Company | USA |
Please find the link to the report in Microwave Magazine https://ieeexplore.ieee.org/document/10274522.