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2023 IMS (San Diego, CA, USA), June 14-15, 2023

The prestigious International Microwave Symposium (IMS 2023) in San Diego once again hosted the IEEE MTT-S Inter-Society Technology Panel (ISTP) program. This program aims to strengthen collaborations and exchange ideas on technologies of interest between the MTT-S and other entities, including the IEEE Societies, councils, and non-IEEE organizations. The panels are organized to facilitate coordinated conversations on emerging applications and future trends, bringing together diverse perspectives and interests. In this dynamic setting, the participants engage in multidisciplinary discussions, exploring the frontiers of research and development across various sectors. The ISTP program serves as a platform where all parties and partners involved can share their enthusiasm and collectively shape the future.

Panel: Tapping Power WIRELESSLY everywhere? Technologies, Standards and Impact in Our Life

Organizer
Alessandra Costanzo University of Bologna Italy
Naoki Shinohara Kyoto University Japan
J.-C. Chiao Southern Methodist University USA
Ke Wu Polytechnique Montréal Canada
Panelists
Yuji Tanabe AETERLINK Japan
Minoru Furukawa Space Power Technologies Japan
Hiroyuki Tani Panasonic Japan
Charlie Green PowerCAST USA
Hatem Zeine Ossia USA
Paul Mitcheson Imperial College London UK
Jason Gill PowerCAST USA

Panel: RF/Microwave Packaging and Interconnect Technologies for Global Integration – Are We on the Right Track?

Organizer
Kamal Samanta Sony Europe UK
Manos Tentzeris Georgia Tech USA
J.-C. Chiao Southern Methodist University USA
Ke Wu Polytechnique Montréal Canada
Panelists
Kevin Gu Metawave USA
Patrick Reynaert KU Leuven and IMEC Belgium
Beth Keser International Microelectronics Assembly and Packaging Society USA
Premjeet Chahal National Science Foundation USA
Harshpreet Bakshi Texas Instruments USA
Tim Lee The Boeing Company USA

Please find the link to the report in Microwave Magazine https://ieeexplore.ieee.org/document/10274522.