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2022 IMS (Denver, CO, USA), June 22-23, 2022

The Inter-Society Technology Panel (ISTP) program aims to strengthen collaborations and idea exchange with other IEEE entities and non-IEEE organizations and lead multidisciplinary and cross-sectorial activities over targeted applications as described in the introductory presentation of this new IEEE Microwave Theory and Technology Society (MTT-S) initiative in this issue. The MTT-S launched the ISTP initiative in 2020 with two inaugural ISTPs successfully organized during the 2021 International Microwave Symposium (IMS2021).

In IMS 2022, the two ISTPs were organized by Dr. Jasmin Grosinger (Graz University of Technology), Dr. Ke Wu (Polytechnique Montreal), Dr. Oren Eliezer (Ambiq), and Dr. J.-C. Chiao (Southern Methodist University).

Panel: The Trend of Tiny AI: Will Ultra-Low-Power Fully-Integrated Cognitive Radios Become a Reality?

Organizer
Oren Eliezer Ambiq USA
Jasmin Grosinger Graz University of Technology Austria
Panelist
Alyssa Apsel Cornell University USA
Nuno Borges Carvalho University of Aveiro Portugal
Scott Hanson Ambiq USA
Gernot Hueber Silicon Austria Labs Austria

Panel: Wearables – Our Life Depends on Them!

Organizer
J.-C. Chiao Southern Methodist University USA
Ke Wu Polytechnique Montréal Canada
Panelist
Manos Tentzeris Georgia Tech USA
Patrick Mercier University of California, San Diego USA
Alessandra Costanzo University of Bologna Italy
Colin Drummond Case Western Reserve University USA
Ilja Ocket IMEC, Leuven Belgium
Eric Chow Abbott Diabetes Care USA

Please find the link to the report in Microwave Magazine https://ieeexplore.ieee.org/document/10004835.