23:51 GMT
2024 EuMW (Paris, France), September 24-25, 2024
The prestigious 2024 European Microwave Week (EuMW 2024) in Paris, France, featured the annual IEEE Microwave Theory and Technology Society (MTT-S) Inter-Society Technology Panel (ISTP) program, which had its European inauguration at EuMW 2022 in Milan, Italy. This program is designed to ignite collaboration and idea exchanges on innovative and cross-sectorial technologies covered within the technical scopes of the MTT-S and other Societies and councils within and beyond IEEE. By organizing panels that focus on emerging applications and future trends, the ISTP program fosters coordinated discussions that integrate diverse perspectives with a platform to share multidisciplinary enthusiasm and vision for the future. There were two successful ISTP panels organized for EuMW 2024, described as follows.
1. Panel: Will Microwave Innovations Provide Energy Sustainable Solutions?
Organizer | |||
Jasmin | Grosinger | Graz University of Technology | Austria |
Smaïl | Tedjini | Grenoble-inp/LCIS University Grenoble, Alpes Valence | France |
Panelists | |||
Ke | Wu | Ecole Polytechnique | Canada |
Nuno | Carvalho | Universidade de Aveiro | Portugal |
Pierre | Blondy | Universite de Limoges | France |
Mohammad | Zarifi | University of British Columbia | Canada |
Yang | Yang | University of Technology Sydney | Australia |
Stefania | Monni | TNO and Eindhoven University of Technology | Netherlands |
2. Microelectronics and Chip Acts: Attractivity, Youth, and Environment
Organizer | |||
Florence | Podevin | University of Grenoble Alps | France |
Patricia | Desgreys | Telecom ParisTech | France |
J.-C. | Chiao | Southern Methodist University | USA |
Panelists | |||
Timothy | Lee | IEEE USA President-Elect | USA |
Elodie | Richalot-Taisne | University Gustave Eiffel | France |
Eric | Mercier | CEA-Léti | France |
Isabelle | Corbett-Etchevers | Université Grenoble Alpes | France |
Gregory | Clark | Qorvo | USA |
Please find the link to the report in Microwave Magazine https://ieeexplore.ieee.org/document/10913984.