ISTP at EuMW 2023 Column

2023 EuMW (Berlin, Germany), Sept. 19-20, 2023

The Inter-Society Technology Panel (ISTP) program was established in 2021 by the IEEE Microwave Theory and Technology Society (MTT-S) as a new initiative under the auspices of the MTT-S Inter-Society Committee. This program, currently led by Drs. Ke Wu and J.-C. Chiao, collaborated with the 2023 European Microwave Week (EuMW) Steering Committee and ISTP organizers to develop two exciting panels for EuMW 2023 in Berlin, Germany. The ISTP program’s goal is to provide an international platform for collaboration and exchanges of ideas among members of MTT-S, other IEEE entities (societies and councils), and non-IEEE organizations. These panels aim to facilitate discussions on cross-disciplinary research and development, involving academia, industry, standards, and commercial sectors in the context of emerging technologies and applications.

The two recent ISTPs at EuMW 2023 were dedicated to emerging issues and future prospectives in biomedical electromagnetics and wireless powering. The biomedical applications panel, titled “Beyond Science Fiction: How Wireless Signals, RF Properties of Biomolecules, Antenna Engineering, and Short Electric Pulses Are Shaping the Future of Biomedical Technologies,” was held from 4:40 p.m. to 6:20 p.m. on Tuesday, 19 September 2023.

1. Beyond Science Fiction: How Wireless Signals, RF Properties of Biomolecules, Antenna Engineering, and Short Electric Pulses are Shaping the Future of Biomedical Technologies

2. Panel: Wireless Power Technologies: Practical Considerations in Industry

Please find the link to the report in Microwave Magazine https://ieeexplore.ieee.org/document/10387945.