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2024 APMC (Bali, Indonesia), November 18-19, 2024

The Inter-Society Technology Panel (ISTP) program, initiated in 2021 by the IEEE Microwave Theory and Technology Society (MTT-S) Inter-Society Committee, has emerged as a distinguished platform for fostering multidisciplinary collaboration, cross-sectorial engagement, and pioneering innovation. Following its inaugural success for the edition of the Asia-Pacific Microwave Conference (APMC) with two panels at APMC 2023 in Taipei, Taiwan, the program was once again prominently featured at APMC 2024, held in Bali, Indonesia.

Fueling the spirit of global collaboration, the ISTP program endeavors to transcend the traditional boundaries of technical sessions, positioning itself as a catalyst for fostering transformative exchanges and visionary partnerships among members of the MTT-S, other IEEE Societies and councils, and non-IEEE organizations. These meticulously designed panels are intended to promote in-depth discussions on cross-disciplinary research and development, engaging stakeholders from academia, industry, standardization bodies, governments, and the commercial sector within the framework of technologies and applications of emerging importance.

The ISTPs are structured to feature coordinated presentations and dynamic discussions, incorporating diverse perspectives from panelists with varied domains of expertise. Within this interactive setting, participants are encouraged to engage in interdisciplinary dialogs, exploring pioneering research and innovative advancements across a broad spectrum of fields. Serving as a critical platform for the exchange of knowledge and ideas, the ISTP program inspires enthusiasm, drives innovation, and facilitates the creation of synergies across disciplines, collaboratively shaping the future of technology through cross-sector engagement and intellectual collaboration.

1. Panel: RF & Microwave Biomedical Technologies and Industries

Organizer
Arie Pangesti Aji Universitas Dian Nusantara Indonesia
Syed Muzahir Abbas Macquarie University Australia
Ke Wu Polytechnique Montréal Canada
J.-C. Chiao Southern Methodist University USA
Panelists
Warsito Taruno C-TECH Laboratories Indonesia
Yusuf Nur Wijayanto Research Center for Electronics, BRIN Indonesia
Kazuyuki Saito Chiba University Japan
Daniel Kartawiguna Siemens Healthineers Indonesia
Amin Abbosh The University of Queensland Australia

2. Panel: Multidisciplinary publications: Meet the Editors

Organizer
Arie Pangesti Aji Universitas Dian Nusantara Indonesia
Syed Muzahir Abbas Macquarie University Australia
Ke Wu Polytechnique Montréal Canada
J.-C. Chiao Southern Methodist University USA
Panelist
Roberto Gómez-García Catedrático de Universidad Spain
Robert Caverly Villanova University USA
Karu Priyathama Esselle University of Technology Sydney Australia

Please find the link to the report in Microwave Magazine https://ieeexplore.ieee.org/document/11023923.