3D-/4D-/Inkjet-Printed RF Components and Modules for IoT and Smart Skins

Date of original webcast: 
Wednesday, February 1, 2017

Numerous inkjet-/3D-printed flexible antennas, RF electronics and sensors fabricated on paper and other polymer (e.g.LCP) substrates offer a system-level solution for ultra-low-cost mass production of Millimeter-Wave Modules for Communication, Energy Harvesting and Sensing applications. Prof. Tentzeris will explore:

  • State-of-the-art area of 3D/inkjet-printed fully-integrated wireless sensor modules on paper or flexible substrates and demonstrate the unique capabilities of additive manufacturing for the fully 3D integration of arbitrary-shape wireless sensors with RF systems on virtually every substrate (glass, paper, plastic, ...)
  • The first realizations of 4D (morphing/shape changing/origami) multilayer RF/microwave structures, that could potentially set the foundation for the truly convergent wireless sensor ad-hoc networks of the future with enhanced cognitive intelligence and "rugged" packaging.
  • Power sources of "near-perpetual" RF modules, including flexible miniaturized batteries as well as energy harvesting approaches involving thermal, EM, vibration and solar energy forms.
  • mmW wearable (e.g. biomonitoring) antennas and RF modules, as well as the first examples of the integration of inkjet-printed nanotechnology-based (e.g.CNT) sensors on paper and organic substrates for Internet of Things (IoT), 5G and autonomous vehicles applications.
  • Newly developed 3D ramp interconnects and on-chip/on-package printed RF components for further miniaturization and enhanced reliability. It has to be noted that the paper will review and present challenges for inkjet- and 3D-printed organic active and nonlinear devices and printable transparent RF electronics as well as future directions in the area of environmentally-friendly ("green") RF electronics and "smart-skin' conformal sensors.

Attendance is free. To access the event please register.

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Manos M. Tentzeris

Professor, School of ECE
Georgia Institute of Technology

Professor Tentzeris graduated from Ionidios Model School of Piraeus, receiving his degree in Electrical Engineering and Computer Science from the National Technical University in Athens, Greece, and then M.S. and Ph.D. degrees in Electrical Engineering and Computer Science from the University of Michigan, Ann Arbor. He is currently a Ken Byers Professor in the area of flexible electronics with the School of ECE, Georgia Tech and he has published more than 600 papers in refereed Journals and Conference Proceedings, 5 books and 25 book chapters. He has served as the Head of the Electromagnetics Technical Interest Group of the School of ECE, Georgia Tech. Also, he has served as the Georgia Electronic Design Center Associate Director for RFID/Sensors research from 2006-2010 and as the GT-Packaging Research Center (NSF-ERC) Associate Director for RF research and the leader of the RF/Wireless Packaging Alliance from 2003-2006. Dr. Tentzeris is also the Head of the A.T.H.E.N.A. Research Group. He is a Fellow of IEEE, a member of MTT-15 Committee, an Associate Member of European Microwave Association (EuMA), a Fellow of the Electromagnetics Academy, and a member of Commission D, URSI and of the the Technical Chamber of Greece. He is the Founder and Chair of the newly formed IEEE MTT-S TC-24 (RFID Technologies). He is one of the IEEE C-RFID Distinguished Lecturers and he has served as one IEEE MTT-Distinguished Microwave Lecturers (DML).

MODERATOR: Michael C. Hamilton, Ph.D.

Dr. Michael Hamilton is an Associate Professor, Electrical and Computer Engineering Dept., Auburn University and Assistant Director of the Alabama Microelectronics Science and Technology Center.

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