Mission Statement
It is the mission of the MTT-2 Microwave Acoustics Technical Committee to monitor the developments in the field of emerging microwave acoustic device and system application technologies, plan and coordinate the actvities of the MTT Society in these areas, and to promote the dissemination of knowledge. Microwave Acoustics include both bulk acoustic wave (BAW) and surface acoustic wave (SAW) technology.
The Committee:
Chair: Dr. Clemens Ruppel, EPCOS AG, Munich, Germany
c.c.ruppel@ieee.org
Co-Chair: Prof. Dr. Robert Weigel, University of Erlangen-Nuremberg, Erlangen, Germany
r.weigel@ieee.org
Committee members:
Dr. Robert Aigner, Triquint, Orlando, USA
raigner@tqs.com
Prof. Dr. Ken-Ya Hashimoto, Chiba University, Chiba, Japan
ken@usl.te.chiba-u.ac.jp
Dr. Ken Lakin, TFR, Bend, Oregon, USA
klakin@aol.com
Prof. Dr. Leonhard Reindl, Albert-Ludwigs-University, Freiburg, Germany
reindl@imtek.de
Dr. Rich Ruby, Avago Technologies, San José, USA
rich.ruby@avagotech.com
Dr. Masanori Ueda
Prof. Dr. Ji Wang, Ningbo University, Ningbo, China
wangji@nbu.edu.cn
Dr. Donald C. Malocha, Univ. of Central, FL
Tel: 407-823-2414
Fax: 407-823-5835
e-mail: d.malocha@ieee.org
Topic: Wireless, Passive Surface Acoustic Wave Tags and Sensors
Abstract:: Surface acoustic wave (SAW) technology can provide wireless, passive RF ID tagging and sensors. There are various embodiments using frequency and time diversity, and coded spread spectrum techniques, to meet differing tagging and sensor applications. New research has shown that single frequency and multi-frequency CDMA tags can be used in a wide variety of passive, wireless, multi-tag, space and commercial applications. This talk will discuss the current research and technology used for SAW tags and sensors, and describe current tag-sensor technology for space and other applications. The use of coding and spread spectrum techniques will show the advantageous of the technology and contrast to silicon RF tags.
Dr. Clemens Ruppel, EPCOS, Munich Germany
Tel: +49-89-636-53325
Fax: +49-89-636-24339
e-mail: Clemens.ruppel@epcos.com
Topic: RF Front-Ends For Multi-Mode, Multi-Band Cellular Phones
Abstract: Cellular systems worldwide are reaching maturity, especially the GSM system, accounting for more than 60% of global (cellular) sales in 2004. At its introduction, only the 900 MHz band was used; a few years later, the DCS band at 1.8 GHz was added. In Europe and Asia, these are still the bands occupied. In the U.S., the GSM system gained interest after the PCS band at 1900 MHz became available. Triple-band GSM phones can be considered the first single-system global phones. Today, with the addition of the 850 MHz band in the U.S., the GSM system spans four bands. In response to consumers asking for higher data rates, the GSM system expanded toward General Packet Radio Service (GPRS) and recently to enhanced data rate for GSM evolution (EDGE). Next to the GSM system, the 3-GPP committee has defined the Universal Mobile Telephone System (UMTS) as a global standard able to deliver data rates exceeding the GSM-EDGE standard by a factor of three. Upcoming high-end multi-mode, multi-band cellular phones will provide operation in several WCDMA bands. The bands of operation depend on the regions, as not all nine bands assigned for WCDMA are available all over the world. Thus, advanced cellular phones will operate in two different modes and will cover up to seven different frequency bands. This increased complexity was a driver for the development of integrated RF front-ends, which include ESD protection, switches, SAW and LC filters, and matching networks at least. In some cases power amplifiers (Pas) and duplexers are integrated too.
Special focus will be on dual mode (GSM and WCDMA) cellular phones with four GSM and three WCDMA bands. On the one hand driven by forward integration – e.g., from PA function via transmit front-end to a fully integrated radio – on the other hand influenced by new requirements of 3G systems and the integration of complementary access, filtering components such as SAW and BAW filters have to solve several increased requirements simultaneously. New technologies are required to follow the demand of increased RF performance, reduced PCB area consumption and continuously decreasing component costs.
Dr. Ken-ya Hashimoto, Chiba University, Chiba Japan
Tel: +81-43-290-3318
Fax: +81-43-290-3320
e-mail: k.hashimoto@ieee.org
Topic: SiP/SoC Integration of RF SAW/BAW Filters
Abstract: RF filters employing surface or bulk acoustic waves (SAW/BAW) have been mass produced and widely used in modern mobile communication equipment. Nowadays various analog functions are going to be merged into the baseband chip, and current concern is how to integrate remaining one, namely the RF front-end. This is not a simple task because major RF functional devices are based on non-Si technologies, and the RF section becomes complex rapidly for supporting multi-band and multi-mode operation.
This talk discusses research trends of the RF SAW/BAW filters, focusing on their possible integration into RF ICs.
First, modern SAW/BAW technologies are introduced, and it is shown how high performances are achievable by the use of current state-of-the-art technologies. Secondly, current front-end modules are surveyed, and then it is discussed how they are going to be integrated with active elements.
Finally, System-in-Package (SiP) and System-on-Chip (SoC) technologies are discussed as a possible solution for the full integration of the RF front end including SAW/BAW devices into RF ICs.
Dr. Ken Lakin, TFR Technologies, Bend, OR
e-mail: kenlakin@ieee.org
Topic: Thin Film Bulk Acoustic Wave Resonators and Filters
Abstract: Microwave acoustic waves have wavelengths that are close to four orders of magnitude smaller than electromagnetic waves for the same frequency. Resonators and filters that are based upon propagating wave structures are accordingly significantly reduced in size. Bulk acoustic wave (BAW) resonators are the high frequency equivalent of the quartz crystal. BAW resonators and filters have been made over the frequency range of 300 MHz to over 12 GHz. These devices offer significant potential for wireless systems and RF instrumentation. This presentation will review the fundamentals of BAW technology, current and potential applications, and manufacturing issues.
Dr. Leonhard M. Reindl, IMTEK, University of Freiburg, Germany
Tel: +49-761-203-7220
Fax: +49-761-203-7222
e-mail: reindl@ieee.org
Topic: Wireless SAW-Based Sensing and Identification
Abstract: In the recent years unwired SAW sensors and identification tags have come under notice with a growing number of publications and applications. In this presentation the operating principles of wireless passive, mostly SAW based identification marks and sensors are shown.
The whole radio based sensor system consists of a read-out unit, comparable to an RADAR device, and a passive transponder, consisting of a surface acoustic wave (SAW) device wired to an antenna. The surface acoustic wave stores the read-out signal for a predefined period of time to suppress all environmental echo interferences. Physical or chemical effects may influence the propagation characteristics of the surface acoustic wave. Two fundamental devices allow storing and modulating of surface acoustic waves: the resonator, and the uniform or chirped delay line.
In the presentation, the transponder setup using a reflective delay line, resonator, or impedance sensor is discussed in detail, as well as the setup of the read out unit using a pulse or FMCW radar. Special emphasis is set on the achievable accuracy and on the sensitivity range. Several applications of such sensor systems and their state-of-the-art performance is presented by way of examples which include identification marks and wireless measurements of temperature, pressure, torque, acceleration, tire-road friction, magnetic field, and water content of soil. A discussion of other resonant structures which also could be used in a passive transponder system will close the presentation.
FBAR (Film Bulk Acoustic Resonators)
K.M. Lakin, "Thin Film Resonators and Filters (Invited Paper)", Proceedings of the 1999 IEEE International Ultrasonics Symposium
Richard C. Ruby, Paul Bradley, Yury Oshmyansky, Allen Chien, John D. Larson III, "Thin Film Bulk Wave Acoustic Resonators (FBAR) for Wireless Applications (Invited Paper)", Proceedings of the 2001 IEEE International Ultrasonics Symposium
K.M. Lakin, "Thin Film Resonator Technology", Proceedings of the 2003 IEEE International Frequency Control Symposium
Rich Ruby, "Film bulk acoustic wave filters and duplexers for high frequency telecommunications using AlN thin films", Proceedings of the 2005 IEEE International Ultrasonics Symposium
SAW (Surface Acoustic Wave) Devices
David Morgan, "Surface-Wave Devices for Signal Processing", Elsevier, 1991
Ken-ya Hashimoto, "Surface Acoustic Wave Devices in Telecommunications", Springer, 2000
Clemens C.W. Ruppel, Tor A. Fjeldly, "Advances in Surface Acoustic Wave Technology, Systems and Applications (Vol. 1), World Scientific, 2000
Clemens C.W. Ruppel, Tor A. Fjeldly, "Advances in Surface Acoustic Wave Technology, Systems and Applications (Vol. 2), World Scientific, 2001