MTT TCC Speakers Bureau

Updated 29 June, 2009

NEW CATEGORY (2009)

EUROPEAN MICROWAVE LECTURER

(Jointly sponsored by MTT-S and EuMA)

NEW TECHNICAL COMMITTEE (2009)

RFID TECHNOLOGIES

(Also see MTT-S Distinguished Microwave Lecturers.  Click here.)

Contact Larry Whicker and Richard Snyder for changes or updates.

Committee Chairs, Speakers, and Abstracts are listed below the table.

Click the highlighted Topical Area in the table to go to Abstracts for that Topical Area.

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Click Speaker's e-mail address to send to Speaker.

Speaker Reimbursement 

TOPICAL AREA

Speaker

 e-mail

MTT-1 Computer Aided Design

 

 

Terahertz Technology Fact or Fiction

Dr. Chris Snowden

c.m.snowden@elec-eng.leeds.ac.uk

Physical Models for Microwave and Millimeter- Wave CAD

Dr. Chris Snowden

c.m.snowden@elec-eng.leeds.ac.uk

Simulation and Modeling of Electrically Large Microwave and Millimeter-Wave Systems

Dr. Michael Steer

m.b.steer@ieee.org

Microwave CAD Using Space Mapping Technology

Dr. John W. Bandler

j.bandler@ieee.org

 

 

 

Mtt-2 Microwave Acoustics                             

 

 

Wireless, Passive Surface Acoustic Wave Tags and Sensors

Dr. Donald C. Malocha

d.malocha@ieee.org

RF Front-Ends for Multi-Mode, Multi-Band Cellular Phones

Dr. Clemens Ruppel

Clemens.ruppel@epcos.com

SiP/SoC Integration of RF SAW/BAW Filters

Dr. Ken-ya Hashimoto

k.hashimoto@ieee.org

Thin Film Bulk Acoustic Wave Resonators and Filters

Dr. Ken Lakin

klakin@aol.com

Wireless SAW-Based Sensing and Identification

Dr. Leonhard M. Reindl

reindl@iieee.org

 

 

 

Mtt-3 Microwave Photonics 

 

 

Techniques and Applications of Analog Optical Links

Dr. Charles Cox, III

ccox@photonicsinc.com

Fiberoptic Links for Satellite Communications

Dr. Afshin S. Daryoush

daryoush@ece.drexel.edu

Optoelectric Ultra-Wideband RF/Wireless Communications

Dr. Chi H. Lee

chlee@eng.umd.edu

Synergy of Optical and Microwave Technologies

Dr. Tibor Berceli

berceli@nov.mht.bme.hu

 

 

 

Mtt-4 Terahertz Techniques

 

 

Terahertz Technology in Outer and Inner Space

Dr. Peter H. Siegel 

phs@caltech.edu

 

 

 

Mtt-5 Microwave High-Power Techniques 

 

 

Minimizing Power Amplifier Memory Effects, or Alternate:

Linearization: Reducing Distortion in Power Amplifiers

Dr. Allen Katz

a.katz@ieee.org

Design and Performance of Microwave and Millimeter-wave High Efficiency Power Amplifiers

Dr. James Komiak

james.j.komiak@baesystems.com

RF/DSP Co-Designed Power Amplifiers/Transmitters for Advanced Wireless and Satellite Applications

Dr. F. M. Ghannouchi

fghannouchi@ieee.org

An Enabling Technology for 3G+ Systems

Dr. F M. Ghannouchi

fghannouchi@ieee.org

 

 

 

MTT-6 Microwave & Millimeter-Wave Integrated Circuits 

 

 

RF/Analog Circuit Design for Wireless Communication Networks

Dr. M. Madihian

Madihian@IEEE.Org 

Millimeter Wave Integrated Circuit Techniques and Technology Dr. Shiban K. Koul, S.K.Koul@IEEE.Org

 

 

 

MTT-7 Microwave & Millimeter-Wave Solid State Devices  

 

 

Contact Committee Chair

 

m.gupta@ieee.org

 

 

 

MTT-8 Filters and Passive Components 

 

 

Analysis and Design of Dielectric Resonators and Filters

Dr. Chi Wang 

chi.wang@ieee.org

Present and Future Filter Design Philosophy: Paradigm Shift in Progress

Dr. R.V. Snyder 

r.snyder@ieee.org

Computing and Enhancing Power Handling in Bandstop Filters

Dr. R.V. Snyder 

r.snyder@ieee.org

Waveguide Filters for Satellites

Prof. V. E. Boria-Esbert

vboria@dcom.upv.es

 

 

 

MTT-9 Digital Signal Processing 

 

 

Contact Committee Chairs

 

Hermann.boss@rohde-schwarz.com

vkchen@lalcatel-lucent.com

 

 

 

MTT-10 Biological Effects and Medical Applications

 

 

Terahertz Technology in Outer and Inner Space

Dr. Peter Siegel 

phs@caltech.edu

 

 

 

MTT-11Microwave Measurements   

 

 

Non-Linear Measurements: From the Power Meter to the LSNA

Jan Verspechi and

 

 Andrea Ferrero

contact@janverspecht.com

 

 ferrero@polito.it

High-Frequency Measurements of Dielectric Substrate Materials

Dr. Michael D. Janezik

janezic@boulder.nist.gov

 Measurements for Modeling

Dr.  Dominique Schreurs

 Dominique.Schurers@kuleuven.be

All You Need to Know About RF & Microwave Coax Connectors But Were Afraid toAsk Nick Ridler nick.ridler@ieee.org
Evaluating Errors and Uncertainties in RF & Microwave Measurements Nick Ridler  nick.ridler@ieee.org
Microwave Fiber-Optic Links: Design and Measurement Issues Dr. Stavros Iezekiel iezekiel@ucy.ac.cy
     

MTT-12 Microwave and Millimeter-Wave Packaging  

 

 

T/R Modules Using 3D and SIP Packaging

Rick Sturdivant

RF_DesignerMan@Yahoo.com

Liquid Crystal Polymer for RF and Millimeter Wave Multi-layer Packages and Modules

Anh-Vu Pham

pham@ece.ucdavis.edu

 

 

 

MTT-13 Microwave Ferrites  

 

 

Ferrite Phase Shifters

Dr. Charles R. Boyd Jr.

crboyd@magsmx.com

 

 

 

MTT-14 Microwave Low-Noise Techniques

 

 

Ultra Low Noise, InP Field Effect Transistors Radio Astronomy Receivers: State -of-the - Art

Dr. Marian Pospieszalski

mpospies@nrao.edu

 

Noise Analysis in Field Transistors Operating Under Small or Large Signal Operation

Dr. Francois Danneville

francois-danneville@iemn.univlille1.fr

 

 

 

MTT-15 Microwave Field Theory 

 

 

Leaky Modes and High-Frequency Effects on Microwave Integrated  Circuits

David R. Jackson

djackson@uh.edu

Geometrical Concepts in Teaching Electromagnetics

Prof. Peter Russer  

russer@tum.de

Metamaterials: Blue-Sky Chimera or Revolution in Microwaves and Photonics Prof. Christopher Caloz christophe.caloz@polymtl.ca

Multi-Level Modeling for Complex Microwave/High-Speed Design

 Prof. Wolfgang Hoefer

WHoefer@ECE.UVIC.ca

Unification of Numerical Methods: A General Mathematical Framework for Derivations and New Scheme Developments Prof. Zhizhang Chen z.chen@dal.ca
     

 MTT-16 Microwave Systems 

 

 

Receiver Protectors for Intense EM Fields

Dr. Roger Kaul

rkaul@ieee.org

State-of-the-Art Time-Domain Measurement and Modeling Techniques for Nonlinear Components and Systems  

Dr. Christopher P. Silva

 chris.p.silva@aero.org

 Microwave Sensors for Industrial Applications

Dr. Reinhard Knoechel 

rk@tf.uni-kiel.de

Transmit/Receive Modules for Phased Array Antennas

Bruce Kopp

bkopp@dpmconsulting.com

 Integrated Millimeter-Wave (Sub-) Systems for Future Satellite Communications

 Dr. Arne F. Jacob

 jacob@tuhh.de

 

 

 

MTT-17 HF/VHF/UHF Technology  

 

 

Microwave Phase Modulators and Shifters

Jozef W. Modelski

j.modelski@ire.pw.edu.pl

A Fully Monolithic HMIC Low Noise Amplifier

T. Boles 

bolest@amp.com

Design of Darlington Based Silicon MMIC Gain Blocks

T. Boles 

bolest@amp.com

RF and Microwave Solid-State Control

Dr. R. Caverly

r.caverly@ieee.org

High Efficiency Amplification of Variable Envelope Signals for Modern Wireless Communications Systems: Doherty and Chireix Re-Visited

Dr. S.C. Cripps

Steve.Cripps@BTInternet.com

High-Efficiency RF-Power Amplifiers

Dr. F.H. Raab  

f.raab@ieee.org

Kahn-Technique Transmitters

Dr. F.H. Raab  

f.raab@ieee.org

Low-Cost High-Efficiency HF Power Amplifiers

Dr. F.H. Raab  

f.raab@ieee.org

Class E Switching-Mode High-Efficiency Power Amplifiers - from RF to Microwave (1 hr.)

N.O. Sokal 

nathan.sokal@compuserve.com

RF Power Amplifiers, Class A through S - How They Operate, and When to Use Each (4 hr. Tutorial) 

N.O. Sokal 

nathan.sokal@compuserve.com

 

 

 

MTT-18 Microwave Superconductivity 

 

 

INACTIVE

 

j.m.pond@ieee.org

charles.wilker@usa.dupont.com

 

 

 

MTT-19 Microwave Technology Business Issues  

 

 

Engineering Your Retirement

Dr.  Mike Golio

m.golio@ieee.org

 

 

 

MTT-20 Wireless Communication  

 

 

Recent Advances in Printed Antennas for Wireless and Satellite Communications

Dr. Rainee N. Simons

Rainee.N.Simons@grc.nasa.gov

 

 

 

MTT-21 MEMs   

 

 

Three Dimensional Millimeter Wave Circuits

Dr. J. Robert Reid

James.Reid@hanscom.af.mil

RF MEMS Devices Using Piezoelectric Thin Films

Dr. Ronald G. Polcawich

rpolcawich@arl.army.mil

Distributed RF-MEMS Circuits

Dr. N. Scott Barker 

barker@virginia.edu

Micromachined Microwave and Millimeter Wave Circuit Design Dr. Shiban K. Koul, S.K.Koul@IEEE.Org

 

 

 

MTT-22 Signal Generation and Frequency Conversion 

 

 

Contact Committee Chair

 

E.Camargo@GMail.Com

Carlos.Saavedra@QueensU.Ca

 

 

 

MTT-23 RFIC

 

 

Contact Committee Chair

 

natalinoc@yahoo.com

     
MTT-24 RFID Technologies    
Inkjet-Printed Electronics   etentze@ece.gatech.edu
     

MTT- TCC-Speakers Bureau

Committee MTT- I:  Computer Aided Design

 

Committee Chair: Michal Odyniec, Tel: 510-524-8373, e-mail: m.odyniec@ieee.org

 

Speaker:

 

Dr. Chris Snowden, Univ. of Leeds, UK

Tel: 44-113-233-2001

Fax:: 44-113-233-2032

e-mail: c.m.snowden@elec-eng.leeds.ac.uk

 

Topic: Terahertz Technology Fact or Fiction

 

Abstract: The interest in exploring the spectrum above 100 GHz and below 10 THz is limited by the availability of suitable solid-state technologies. This presentation addresses the present state-of-the-art for active devices and integrating technologies in the range 100 GHZ to 2 THz.

 

Alternate Topic: Physical Models for Microwave and Millimeter- Wave CAD

 

Abstract: State-of-the-art modeling techniques for microwave and millimeter-wave transistors are presented together with an outline of their application in process-oriented CAD. The presentation will consider MESFET, HBT, and pHEMT devices in the frequency range 900 MHz to 140 GHz.

 

Speaker:

 

Dr. Michael Steer, North Carolina State University

Tel: 919-515-5191

Fax: 919-513-1979

e-mail: m.b.steer@ieee.org

 

Topic: Simulation and Modeling of Electrically Large Microwave and Millimeter-Wave Systems

 

Abstract: Many of the grand challenges in the engineering of microwave and millimeter-wave circuits concerns the complexity of large systems with interacting electromagnetic fields, circuits and thermal effects. This is particularly true with power generation systems where thermal effects significantly affect stability and ultimately power handling capability.

 

Speaker:

 

Dr. John W. Bandler, Bandler Corp., Dundas, ON, Canada

Tel: 905-628-9671

Fax: 905-628-1578

e-mail: j.bandler@ieee.org

 

Topic: Microwave CAD Using Space Mapping Technology

 

Abstract: Space mapping optimization intelligently links "coarse" and "fine" models of different complexities, e.g., full-wave electromagnetic simulations and empirical circuit-theory based simulations, to accelerate iterative design optimization of engineering structures. It is a simple CAD methodology which closely follows the traditional experience and intuition of microwave designers. The exploitation of properly managed space mapping models promises significant efficiency in engineering design optimization practices.

 

Committee: MTT-2 Microwave Acoustics

 

Committee Chair(s): Clemens Ruppel, Tel: 43-732-2468-9710, e-mail: cc.ruppel@ieee.org, Robert Weigel, 43-732-2468097, e-mail: r.weigel@ieee.org

 

Speaker:

 

Dr. Donald C. Malocha, Univ. of Central, FL

Tel: 407-823-2414

Fax: 407-823-5835

e-mail: d.malocha@ieee.org

 

Topic:  Wireless, Passive Surface Acoustic Wave Tags and Sensors

 

Abstract:: Surface acoustic wave (SAW) technology  can provide wireless, passive RF ID tagging and sensors.  There are various embodiments using frequency and time diversity, and coded spread spectrum techniques, to meet different tagging and sensor applications. New research has shown that single frequency and multi-frequency CDMA tags can be used in a wide variety of passive wireless, multi-tag, space and commercial applications. This talk will discuss the current research and technology used for SAW yags and sensors, and describe current tag-sensor technology for space and other applications. The use of coding and spread spectrum techniques will show the advantageous of the technology and contrast to silicon RF tags. 

 

Speaker:

 

Dr. Clemens Ruppel, EPCOS, Munich Germany

Tel: 49-89-636-53325

Fax: 49-89-63645396

e-mail: Clemens.ruppel@epcos.com

 

Topic: RF Front-Ends for Multi-Mode, Multi-Band Cellular Phones

 

Abstract: Cellular systems worldwide are reaching maturity, especially the GSM system, accounting for more than 60% of global (cellular) sales in 2004. At its introduction, only the 900 MHz band was used: a few years later the DCS band at 1.8 GHz was added. In Europe and Asia, these are still the bands occupied. In the U.S. GSM system gained interest after the PCS band at 1900MHz became available. Triple-band GSM phones can be considered in the first single-system global phones. Today, the addition of the 850 MHz band in the U.S., the GSM system spans four bands. In response to consumers asking for higher data rates, the GSM system expanded toward General Packet Radio Service (GPRS) and recently to enhanced data rate for GSM evolution (EDGE).

 

This Talk addresses components for these types of systems. SAW and BAW filters are addressed. Please contact Dr. Ruppel for the expanded Abstract.

 

Speaker:

 

Dr. Ken-ya Hashimoto, Chiba University, Chiba Japan

Tel: 81-043-290-3318

Fax: 81-43-290-3320

e-mail: k.hashimoto@ieee.org

 

Topic: SiP/SoC Integration of RF SAW/BAW Filters

 

Abstract: RF filters employing surface or bulk acoustic wave (SAW/BAW0 have been mass produced and widely used in modern mobile communication equipment. Nowadays various analog functions are going to be merged into the baseband chip, and current concern is how you integrate remaining one, namely the RF front end. This is not a simple task because major RF Functional devices are based on non-Si technologies, and the RF section becomes complex rapidly for supporting multi-band and multi mode operation.           

 

This talk discusses research trends of the SAW/BAW filters, focusing on possible integration into RF ICs.

First, modern SAW/BAW technologies are introduced, and it is shown hoe high performances are achievable by the use of current state-of-the-art technologies. Secondly, current front end modules are surveyed, and then it is discussed how they are going to be integrated with active circuit elements.

 

Speaker:

 

Dr. Ken Lakin, TFR Technologies, Bend, OR

e-mail: klakin@aol.com

 

Topic: Thin Film Bulk Acoustic Wave Resonators and Filters

 

Abstract: Microwave acoustic waves have wavelengths that are close to four orders of magnitude smaller than electromagnetic waves for the same frequency. Resonators and filters that are based upon propagating wave structures are accordingly significantly reduced in size. Bulk acoustic wave (BAW) resonators are the high frequency equivalent of the quartz crystal. BAW resonators and filters have been made over the frequency range of 300 MHz to over 12 GHz. These devices offer significant potential for wireless systems and RF instrumentation. This presentation will review the fundamentals of BAW technology, current and potential applications, and manufacturing issues.

 

Speaker:

 

Dr. Leonhard M. Reindl, IMTEK, Uniiversity of Freidberg, Germany

Tel: 49-761-203-7220

Fax: 49-761-203-7222

e-mail: reindl@iieee.org

 

Topic: Wireless SAW-Based Sensing and Identification

 

Abstract: In the recent years unwired SAW sensors and identification tags have come under notice with a growing number of publications and applications. In this presentation the operating principles of wireless passive, mostly SAW based identification marks and sensors are shown.

The whole radio based sensor system consists of read-out unit, comparable to a RADAR device, and a passive transponder, consisting of a surface acoustic wave (SAW) device wired to an antenna. The surface acoustic wave stores the read-out signal for a predefined period of time to suppress all environmental echo interferences. Physical or chemical effects may influence the propagation characteristics of the surface acoustic wave. Two fundamental devices allow storing and modulation of surface acoustic waves: the resonator, and the uniform or chirped delay line.

 

In the presentation, the transponder setup using a reflective delay line, resonator, or impedance sensor is discussed in detail, as well as the setup of the read out unit using a pulse of FMCW radar. Special emphasis is set on the achievable accuracy and on the sensitivity range. Several applications of such sensor systems and their state-of-the-art performance are presented by way of examples. An expanded version of the Abstract is available from Prof. Reindl.

 

Committee: MTT-3 Microwave Photonics

 

Committee Chair(s): Dieter Jaeger, Tel: 49-203-379-2341, e-mail: dieter.jaeger@uni-due.de, Dalma Novak, 410-590-3333, e-mail: d.novak@ieee.org      

 

Speaker:

 

Dr. Charles Cox III, Photonic Systems, Inc.

Tel: 781-272-1819

Fax: 781-272-4654

e-mail: ccox@photonicsinc.com

 

Topic: Techniques and Applications of Analog Optical Links

 

Abstract: This presentation gives an introductory overview of analog links: direct and external modulation, figures of merit such as gain, noise figure and dynamic range and applications.

 

Speaker:

 

Dr. Afshin S. Daryoush, Drexel University

Tel: 215-895-2362

Fax: 215-895-1695

e-mail: daryoush@ece.drexel.edu

 

Topic: Fiberoptic Links for Satellite Communications

 

Abstract: Future generation of communication satellites are based on phased array antennas to generate over 100 simultaneous beams to provide communications services to mobile and fixed terminal users.  The feed network operating at Ka-band is a major challenge and optical beam forming networks (OBFN) are considered as a desired technology.

 

Speaker:

 

Dr. Tibor Berceli, Professor, Technical University of Budapest

Tel: 36-1-463-4142

 Fax: 36-1-463-3289

 e-mail: berceli@nov.mht.bme.hu

 

Topic: Synergy of Optical and Microwave Technologies

 

Abstract: The lecture presents the combination of optical and microwave technologies offering new and better approaches for many applications. First the optical-microwave interaction principles are treated. That is followed by optical control of microwave circuits, optical-microwave mixing methods, processing of sub-carrier multiplexed optical signals, integration of wireless and optical techniques.

 

Speaker:

 

Dr. Chi H. Lee, Univ. of Maryland

 Tel: 301-405-3739

Fax: 301-314-9281

 e-mail: chlee@eng.umd.edu

 

Topic: Optoelectric Ultra-Wideband RF/Wireless Communications

 

 Abstract: An optoelectronic ultra-wideband RF/wireless communications system is proposed. We refer this new technology as opto-impulse radio. Impulse modulation is a wireless transmission format for multipath and interference environments. It can provide a jam-resistant, high security, low-power RF communications link. Photoconductive (PC) switches are used as front-end elements in wireless impulse communications systems. Direct sequence code division is used to enhance an ultra-wideband impulse modulation communication system. Experimental results show an aggregate processing gain of 44 dB using a 750 MHz spreading bandwidth.

 

 

Committee MTT-4: Terahertz Techniques

 

Committee Chair(s):  Peter Siegel, Tel: 818-354-9089, e-mail: phs@catech.edu , Koji Mizuno, Tel: 81-22-217-5515, e-mail: koji@riec.toku.ac.jp

 

Speaker:

 

Dr. Peter H. Siegel, JPL, Pasadena, CA

Tel: 818-354-9087

e-mail: phs@caltech.edu

 

Topic: Terahertz Technology in Outer and Inner Space

 

Abstract: After more than 30 years of niche applications in the space sciences area, the field of Terahertz Technology is entering a true Renaissance. While major strides continue to be made in sub-millimeter wave astronomy and spectroscopy, the past few years have seen an unprecedented expansion of Terahertz applications, components and instruments. Broad popular interest in this frequency domain has emerged for the first time, spanning applications in diverse as biohazard detection and tumor recognition. Already there are groups around the world who have applied specialized Terahertz techniques to disease diagnostics (1), recognition of protein structural states (2), monitoring of receptor-bindings (3), performing label-free DNA sequencing (4) and visualizing contrast in otherwise uniform tissue (5). A commercial Terahertz imaging system has recently started tests in a hospital environment (1) and high sensitivity imagers with deeper penetration into tissue have begun to emerge (6). Solicitations for more sophisticated instruments and enabling Terahertz components have filtered into US agency proposals from DoD and NASA, to NSF and NIH, and many research groups have sprung up, both in this country and in Europe and Asia. This talk will broadly survey Terahertz technology from its cradle applications in space science and spectroscopy to more recent biomedical and chemical uses.*

 

* Contact LRW for references and expanded summary by Dr. Siegel

 

 

Committee MTT-5: Microwave High-Power Techniques

 

Committee Chair:  Kiki Ikossi, Tel: 1-703-960-0261, e-mail: Ikossi@IEEE.Org

Vice Chair: Joe Qiu,  Tel: 1-310-394-2532, e-mail: Joe.Qiu@IEEE.Org

 

Speaker:

 

Dr. Allen Katz

Tel: 609-584-8424

e-mail: a.katz@ieee.org

 

Topic (1): Minimizing Power Amplifier Memory Effects

 

Abstract: Memory effects are changes in an amplifiers non-linear characteristics resulting from the past history of the input signal. Predistortion linearization depends on a stable non-linear response, and can be significantly degraded by memory effects. This presentation will begin with an overview of linearization techniques and the application of digital signal processing (DSP) to the correction of distortion in power amplifiers. The problems caused by memory effects will be introduced, Different sources of memory effects will be discussed and techniques for their suppression presented.

  

Topic (2): Linearization: Reducing Distortion in Power Amplifiers

 

Abstract: Our Society's need to exchange greater and greater amounts of information has created an unprecedented demand for highly linear power amplifiers. High linearity is required for the spectrally efficient transmission of information. This presentation will discuss techniques for the cancellation of distortion that are also known as linearization. Different methods of linearization including digital approaches will be introduced and compared. The linearization of solid-state power amplifiers, traveling wave tubes amplifiers and klystron power amplifiers will be considered. Criteria for the evaluation of linearity will be reviewed and special attention given to problems unique to SSPAs.

 

Speaker:

 

Dr. James Komiak

Tel: 603-885-6910

e-mail: james.j.komiak@baesystems.com

 

Topic: Design and Performance of Microwave and Millimeter-wave High Efficiency Power Amplifiers

 

Abstract: Device technologies covered include SiBJT, MESFET, HBT, PHEMT, InP, MHEMT, and Wide Bandgap (SiC, GaN) Content includes principles of operation, structures, characteristics, and state of the art benchmarks. Power amplifiers utilizing these device technologies covering L-Band through W-Band are described including state of the art benchmarks.

 

Speaker:

 

Dr. F. M. Ghannouchi

Tel: 403-220-5807

e-mail: fghannouchi@ieee.org

 

Topic 1 RF/DSP Co-Designed Power Amplifiers/Transmitters for Advanced Wireless and Satellite Applications

 

Abstract: The wireless and satellite communications communities have always been looking for power- and spectrum-efficient amplification systems. The design of such power amplifiers has to be considered closely together with the system architecture in order to ensure optimal system level performances in terms of linearity and power efficiency. This implies the use of adequate transmitter's architectures that convert the analog base band information to architecture dependent amplifier driving signals such as sigma-delta, EE&R, and LINC architectures. This seminar lays out the principles behind the software enabled linear and highly efficient power amplifiers/transmitters sub-systems. Design and practical realization of RF/DSP co-designed transmitters for MC-CDMA and OFDM wireless applications will be presented.

 

Topic 2: Linearization: An Enabling Technology for 3G+ Systems

 

Abstract: This talk briefly presents the basic concepts of linearization technology as well as the reason why linearization is being considered as an enabling technology for 3G and beyond wireless communication systems, Included will be the description and explanation and how linearization favorably affects both spectrum and power efficiencies of transceivers and what are the devices the system based techniques available to the designer of nonlinear communication circuits and systems. Feedback, feed forward and predistortion based linearization techniques will be presented. Important and critical issues in designing these linearizers will be discussed in light of the broadband communications applications targeted either for handheld or base station terminals. Examples of analog, digital, or hybrid implementations will be presented and discussed.

 

 

Committee MTT-6: Microwave and Millimeter-Wave Integrated Circuits

 

Chair: Frank Sullivan, Tel: 978-440-2276, e-mail: f.sullivan@ieee.org , John Pierro, Tel: 631-439-9137, e-mail: jpierro@miteq.com

 

Speaker:

 

M. Madihian, NEC Corporation of America.

Tel: 609-951-2916

Fax: 609-951-2499

e-mail: Madihian@IEEE.Org

 

Topic: RF/Analog Circuit Design for Wireless Communication Networks

 

Abstract: Demand for wireless terminals with location-free multimedia services has urged development of low-cost low-noise low-distortion small-size front-end modules with switching. RF/IF amplification, synthesizers, and down/up conversion features. The lecture will cover design of amplifier, mixer, switch, oscillator, and frequency-doubler/divider building blocks using the optimum device technology. The lecture will also provide an understanding of S-parameters and their application to the circuit design.

 

Speaker:

 

Prof. Shiban K Koul, Indian Institute of Technology Delhi, India; Tel: +919811209829; Fax:: +91-11-26863165

            e-mail: s.k.koul@ieee.org    or   shiban_koul@hotmail.com

 

Topic: Millimeter Wave Integrated Circuit Techniques and Technology

 

Abstract: Millimeter waves offer widespread applications in defense, space and commercial sectors. In this talk, different technologies for building Millimeter Wave Integrated Circuits and Subsystems will be presented. Starting from conventional microstrip technology, other key technologies including suspended stripline, dielectric integrated guide, finline, LTCC, MEMS, MMIC and polystrata will be described. Design methodology leading to development of several high performance components/ subsystems at 35 GHz, 60 GHz and 140 GHz along with experimental results will be presented. The talk will conclude by giving a comparison of various technologies.

 

 

 

 

Committee MTT-7: Microwave and Millimeter-Wave Solid State Devices

 

Committee Chair(s):  Madhu S. Gupta, Tel: 619-594-7015, e-mail: m.gupta@ieee.org

 

Speaker: Contact Committee Chair

 

 

Committee MTT-8: Filters and Passive Components

 

Committee Chair:    Sridhar Kanamaluru, Tel: 717-397-2777, Ext 3163, e-mail: skanamaluru@ieee.org

Vice Chair:                Ming Yu, Tel: 519-622-2300, Ext 2503, e-mail: ming.yu@Comdev.ca

 

Speaker:

 

Dr. Chi Wang, Orbital Sciences Corporation

Tel: 703-948-8240

Fax: 703-948-8526

e-mail: chi.wang@ieee.org

 

Topic: Analysis and Design of Dielectric Resonators and Filters

 

 Abstract: In 1939 R.D. Richtmyer first presented the concept of dielectric resonators (DRs). In 1960's Harrison and Cohn Presented TE 01+ mode resonator filter and its approximate analysis method. Starting from the properties of the dielectric resonator and Cohn's simple DR model, this presentation will give detailed information including DR's resonant modes and rigorous full wave modeling and design method. Basic types of DR and DR filters are presented. TE01 single-mode filters offer the advantages of design simplicity and flexibility in layout options over HE11 dual mode filters, while dual-mode filter has the significant advantages on the mass and volume of the products. Mixing the TE01 and HE11 modes dielectric loaded cavity in a filter can achieve excellent out of band spurious performance.           

           

 

 

Speaker:

 

Dr. R.V. Snyder, RS Microwave

Tel: 973-492-1207

Fax: 973-492-2471

e-mail: r.snyder@ieee.org

 

 

Topic 1: Present and Future Filter Design Philosophy: Paradigm Shift in Progress

 

Abstract: The design of passive filter networks has traditionally been a process in which approximations are made to a desired transfer function using reactive and resistive elements exhibiting the same frequency-dependent functional form. Over the years, a variety of synthesis techniques have been developed that allow for extracting sets of such elements from the transmission and reflection functions associated with approximating the desired transfer function when terminated with a specified source and load impedance. We know that physically it is not difficult to combine lumped, distributed and evanescent elements in the same network. Optimization allows for insertion of elements with different frequency dependencies, but exact synthesis is generally not possible. This presentation will address present approaches and will provide insight into future design approaches.

 

Topic 2: Computing and Enhancing Power Handling in Bandstop Filters

Abstract: Notch filters are increasingly important components in high power communication systems. Cosite interference analog suppression techniques depend heavily on eliminating emission of spurious high power signals at the source, or suppressing such signals prior to a receiver. Understanding and enhancing the ability of notch filters to survive exposure to high RF power is the subject of this presentation. The power handling capability of bandpass and lowpass filters has been studied and much published material is readily available. However, bandstop and highpass filters have not been studied as thoroughly (or public results are not as easy to find). In this presentation, we will present the basic computational basis for determining power handling and suggest methods for increasing the breakdown and/or heat-related failure thresholds.

 

Speaker:

 

Prof. Vicente E. Boria-Esbert

Technical University of Valencia

Tel: +34 96 387 9718 (+34 656 357732)

Fax: +34 96 387 7309

e-mail: vboria@dcom.upv.es

 

Topic: Waveguide Filters for Satellites

 

Abstract: An overview of all-metal waveguide filters for satellite payloads is offered in this talk. Initially, an historical evolution of this filtering technology, including typical electrical and mechanical requirements, is outlined. Next, recent advancements in full-wave analysis methods and automated design procedures of these filters are reviewed. Then, a Computer-Aided Design (CAD) tool based on such techniques (i.e. FEST3D "Full-Wave Electromagnetic Software Tool for 3D Waveguide Components") is introduced, and its practical application to the analysis and design of several examples of satellite filters is presented. In particular, direct-coupled rectangular waveguide filters, E-plane waveguide technology, dual-mode filtering prototypes and evanescent mode waveguide filters are considered. Classical topologies, as well as more novel configurations for each filter class, are discussed.

 

 

Committee MTT-9: Digital Signal Processing

 

Committee Chair(s):  Hermann Boss, Tel: 49-894-129-13606, e-mail: Hermann.boss@rohde-schwarz.com  Y.K. Chen, Tel: 908-582-7956, e-mail: vkchen@lalcatel-lucent.com

 

Speaker:

 

Dr. James B.Y. Tsui, AFRL/SNRP, WPAFB, OH

Tel: 937-255-6127 x 4320

Fax: 937-255-7135

e-mail: tsuiijb@sensors.wpafb.af.mil

 

Topic: Digital RF Receivers

 

Abstract: A recent trend in building RF receivers is to use digital techniques to replace conventional analog approaches, since the digital approach can provide significant advantages. This task addresses the performance requirements of analog-to-digital converters in the receiver system, and several approaches for building wide and narrow band receivers.

 

  

Committee MTT-10: Biological Effects and Medical Applications

 

Committee Chair(s):  Mohammad Tofighi, Tel: +1 215-895-1913 , e-mail: mtofighi@psu.edu

Vice Chair: Arye Rosen,  Tel: +1 717-948-6112, e-mail: arye.rosen@drexel.edu

 

Speaker:  Dr. Peter Siegel, JPL, Pasadena, CA

Tel: 818-354-9087

e-mail: phs@caltech.edu

 

Topic:  MTT-10 is Co-Sponsor of DR. Siegel's Talk with MTT-4. The Abstract is listed under MTT-4.

 

 

Committee MTT-11: Microwave Measurements

 

Committee Chair:  Kate Remley, e-mail: remley@boulder.nist.gov

 

Speakers:

 

Dr. Jan Verspecht or Prof. Andrea Ferrero (both speakers deliver same talk)

 

J. Verspecht (Point of contact for this topic)

Tel: 32-479-85-59-39

e-mail:    contact@janverspecht.com

 

Andrea Ferrero

Tel: 390115644082

e-mail: ferrero@polito.it

 

Topic: Non-Linear Measurement: From the Power Meter to the LSNA

 

Abstract: This presentation covers the most important aspect of Non-Linear microwave device characterization from the early beginning of power meters to the most advance instruments available today like e.g. the Large Signal Network Analyzers. The presentation deals with nonlinear characterization techniques for individual power transistors as well as for communication systems: fundamental and harmonic load-pull measurements, spectral regrowth measurements (ACRP), intermodulation measurements (IM3, IM5, ...), harmonic distortion analysis, error vector magnitude measurements and hot S-parameter techniques. Next to covering the broad topic of nonlinear microwave measurements, the audience will be educated on Large-Signal Network Analyser (LSNA) instruments that can accurately and completely characterize devices under realistic large signal operating conditions.

 

 

Speaker:

 

Michael D. Janezik, NIST, Boulder, CO

e-mail: janezic@boulder.nist.gov

 

Topic: High-Frequency Measurements of Dielectric Substrate Materials

 

Abstract: High Performance substrate materials are required for high frequency and wideband applications. In this presentation both transmission-line and resonant techniques for measuring the relative permittivity and loss tangent of dielectric substrates such as printed-circuit boards, printed-wiring boards and ceramic substrates over the 1 to 100 GHz. Transmission-line measurements include on-wafer material measurements using planar structures such as coplanar waveguides and microstrip transmission lines. Three resonant measurement techniques are overviewed including: the split-cylinder; split-post; and Fabry-Perot resonators. The presentation concludes with a discussions of the merits and limitations of each technique.

 

Speaker:

Dominique Schreurs, KU Leuven, Belgium

Dominique.schurers@kuleuven.be

 

Topic:  Measurements for Modeling

 

Abstract: Models aimed for microwave and millimeter wave circuit design are typically based on measurements as opposed to physical simulations. The time needed to acquire the data often takes longer than the model extraction itself. The talk will focus on ways to render the characterization process more efficiently. A distinction is made between measurements for passive components and measurements for active devices and circuits. Issues such as propagation of calibration and de-embedding inaccuracies into model parameter extraction are addressed. By means of various examples, adaptive data collection and excitation design are covered. Finally, the optimal selection of measurements for thorough model validation will be elaborated upon.

 

 

Speaker:

 

Nick Ridler

National Physical Laboratory, UK

Tel: +44 20 8943 7116

 nick.ridler@ieee.org

 

 Topic 1:  All You Need to Know About RF & Microwave Coax Connectors But Were Afraid toAsk

 

Abstract: The humble coaxial connector has been a regular player in the high frequency electronics industry for the past fifty years or more.  But it is this apparent familiarity, and apparent simplicity, that often leads to misunderstandings and mistakes with the use of connectors.  This talk will give a review of coax connectors with an emphasis on how to get the most from any given connector.  The talk begins with an historical overview of the evolution of the coax connector right up to the present day.  The dos and don’ts of using connectors will also be addressed and how to select the best connector for a given application.  Finally, some tips will be given on how to keep connectors in good health and how to ensure long connector life.  

 

Topic 2:  Evaluating Errors and Uncertainties in RF & Microwave Measurements

 

Abstract: This talk gives an overview of the principles and processes involved in dealing with errors in measurements, particularly at RF and microwave frequencies.   The talk shows how the concept of uncertainty can be used to quantify the effects of errors that occur during measurements.  The methods used to evaluate and express uncertainty are described and illustrated with some simple practical examples.  The purpose of this talk is to enlighten rather than mystify the subject of dealing with error and uncertainty in measurement.

 

Speaker:
 
Stavros Iezekiel
University of Cyprus
iezekiel@ucy.ac.cy 
 
Topic: Microwave Fiber-Optic Links: Design and Measurement Issues
 

Abstract: Optical fibre is an excellent transmission medium - it has very low loss and very large bandwidth (especially when compared with microwave transmission media). In addition, it is possible to modulate light at several tens of GHz and then recover that modulation. Hence there has been much interest in the use of optical fibre for the transmission and processing of RF signals.

 

In the first part of the talk, some of the basic design issues for analogue links will be discussed. In particular, the effect of component-to-component interaction on small-signal, large-signal and noise performance will be considered. It will be seen that it is useful to be able to model and measure the "microwave characteristics" of optoelectronic and optical components. In the second part of the talk, various techniques for the measurement of high-speed lightwave components will be outlined. The emphasis will be on extending microwave network analyser techniques to these devices. Issues associated with polarization effects, optical cavity resonances and nonlinearity will be discussed in some detail.

 

 

Committee MTT-12: Microwave and Millimeter-Wave Packaging

 

Committee Chair: Chair: Robert W. Jackson, jackson@ecs.umass.edu <x-msg://43/jackson@ecs.umass.edu>  
Vice Chair: Paul Garland, paul.garland@kyocera.com <x-msg://43/paul.garland@kyocera.com>

 

Speaker:

 

Rick Sturdivant

President

Microwave Packaging Technology, Inc.

1275 North Tustin Ave.

Anaheim, CA 92807

Tel: 310-980-3039

RF_DesignerMan@Yahoo.Com

 

 

Topic:  T/R Modules Using 3D and SIP Packaging

 

Abstract: T/R modules have traditionally used metal housings with glassed-in interconnects and ceramic substrates.  More recent approaches use 3D stacked substrates and the tile module approach.  This approach resulted in lower cost, lower-profile and lighter-weight arrays.  With advances in packaging materials and processes, System In a Package (SIP) approaches are being used for T/R modules.  These approaches promise the realization of further cost reductions, large "membrane" arrays for space applications and improved array-level manufacturability.  This presentation reviews traditional T/R module packaging, examines a tile module in detail, examines next generation T/R modules using SIP and array-level packaging approaches.  The presentation concludes with a projection on future developments in phased arrays.

 

 

Speaker:

 

Anh-Vu Pham, University of California, Davis

Tel: 530-752-7472

e-mail: pham@ece.ucdavis.edu

 

Topic: Liquid Crystal Polymer for RF and Millimeter Wave Multi-layer Packages and Modules

 

Abstract: We present the design and development of multi-layer organic modules and packages using liquid crystal polymer (LCP). An overview and unique properties of liquid crystal polymer will be discussed. We will present the development of adhesive process that bond LPC to LCP, Si, and printed circuit board materials. These processes are used to develop wafer-scale and surface mount packages for microwave and millimeter wave applications. We will present the electrical characteristics and package performance of wafer scale and surface mount packages up to Ka-band frequencies. Environmental test and evaluation of these packages will be discussed.

 

 

Committee MTT-13: Microwave Ferrites

 

Committee Chair(s):Steven Stitzer, Tel: 410-765-7348, e-mail: s.stitzer@ieee.org , William Alton, e-mail: billa@feriteinc.com

 

Speaker:

 

Dr. Charles R. Boyd Jr., Microwave Applications Group,

Santa Maria, CA, 93455

Tel: 805-928-5711

Fax: 805-925-5903

e-mail: crboyd@magsmx.com

 

Topic: Ferrite Phase Shifters

 

Abstract: Review of ferrite materials. Ferrite phase shifter types, characteristics, and selection criteria. Introduction to simple methods for analysis of phase shifter performance. Phase shifter control techniques. System applications in one- and two-dimensional electronically scanning phased-array antennas, circulating and reciprocal switches.

 

 

Committee MTT-14: Microwave Low-Noise Techniques

 

Committee Chair(s):  Luciano Boglione, Tel: 617-661-8999, e-mail: L.Boglione@IEEE.Org ; Vice - Philip M. Smith, 603-885-6785, e-mail: Philip.M.Smith@BAESystems.Com

 

Speaker:

 

Dr. Marian Pospieszalski, Nat. Radio Astr. Lab.

Charlottesville, VA 22901

Tel: 434-296-0350

e-mail: mpospies@nrao.edu

 

Topic: Ultra Low Noise, InP Field Effect Transistors Radio Astronomy Receivers: State -of-the - Art

 

Abstract: Over the last quarter century progress in the noise performance of FET and HFET amplifiers at cryogenic temperatures was quite dramatic.  The achievable noise temperatures at particular frequencies were lowered by an order of magnitude and the useful frequency range of cryogenic HFET receivers was extended by about an order of magnitude up to 120 GHz. The presentation will document the course of these developments with special emphasis on the following topics:

 

Noise and signal properties of heterostructure field effect transistors at cryogenic temperatures

Design and examples of realizations of wideband, low-noise, cryogenically-coolable HFET amplifiers in the 3 to 120 GHz range

Examples of realization of receivers for interferometric arrays

Examples of realization of very broadband continuum radiometers

 

Thoughts on future developments in low-noise amplifier technology and the possible new applications of this technology will be offered. A more detailed summary of this talk is available on request.

 

Speaker:

 

Dr. Francois Danneville

IEMN, URM CNRS 8520

59652 Villeneuve d'Ascq Cedex, France

Tel: 33-320197936

e-mail:  Francois-Danneville@iemn.univlille1.fr

 

Topic: Noise Analysis in Field Transistors Operating Under Small or Large Signal Operation

 

Abstract: This talk covers the noise analysis in Field Transistors operating under small or large signal operation. In the first part, a linear distributed high frequency noise modeling for SOI MOSFET is used to discuss the noise sources in a macroscopic level (noise sources representing the noise of a FET as a two port). The trends for future technologic nodes when shrinking the MOSFETs dimensions are also discussed (influence of parasitic elements) as well as the influence of a DC tunneling gate current on the noise performance. In the second part noise properties of III-V HEMTs operating under large signal steady state are covered. The concept of Impedance Field used under linear conditions is extended to nonlinear conditions, allowing for a creation of CAD oriented nonlinear noise model of a FET. The model is then applied to the noise analysis of FET mixers. Also, it is shown how low frequency microscopic noise process (1/f noise, generation-recombination noise) are determining the phase noise in microwave circuits. A more detailed summary of this talk is available on request.

 

 

Committee MTT-15: Microwave Field Theory

 

Committee Chair(s): Peter Russer, Tel: 49-89-289-28390, e-mail: russer@tum.de , David Jackson, Tel: 713-743-4426, e-mail: djackson@uh.edu

 

Speaker:  David R. Jackson, University of Houston

Tel: 713-743-4426

e-mail: djackson@uh.edu

 

Topic: Leaky Modes and High-Frequency Effects on Microwave Integrated Circuits

 

Abstract: This presentation will overview the propagation of leaky modes on planar microwave integrated circuit structures, including microstrip line, covered microstrip line, and stripline with an air gap. A leaky mode is a mode that leaks power as it propagates, with the leakage occurring into the modes of the surrounding substrate structure and in some cases also directly into space (for an open structure). The excitation of leaky modes on planar printed-circuit transmission lines leads to signal attenuation due to radiation, crosstalk, and interference effects (since the leaky modes can interfere with the desired mode of propagation).  Methods for calculating the properties of these leaky modes will be presented, together with ways of predicting when these effects might occur. For an expanded version of this Abstract please contact Prof. Jackson.

 

Speaker: Prof. Peter Russer, Munich University of Technology

Tel: 49-89-289-28391

e-mail: ruser@tum.de

 

Topic: Geometrical Concepts in Teaching Electromagnetics

 

Abstract: This presentation deals with the application of exterior differential forms in teaching electro-magnetics. The  formulation of electromagnetic theory can be simplified and the ability to create concepts can be improved by the use of geometrical methods. The exterior differential calculus establishes a direct connection to geometrical images and provides additional physical insight. Exterior differential calculus has simple and concise rules for computation. Furthermore, the objects of differential calculus have a clear geometric significance and the geometrical laws of electro-magnetics assume a simple and elegant form. Contact Prof. Russer for an expanded Abstract.

 

 

Speaker: Prof. Dr. Christopher Caloz;

École Polytechnique de Montréal

Department of Electrical Engineering

2500, ch. de Polytechnique

Montréal (Québec)

H3T 1J4, Canada

Tel.: +1 (514) 340-4711, ext. 3326

 christophe.caloz@polymtl.ca

 

Topic: Metamaterials: Blue-Sky Chimera or Revolution in Microwaves and Photonics


Metamaterials, which are broadly defined as effectively homogeneous electromagnetic structures exhibiting unusual properties – such as negative refraction, sub-wavelength resolution, coupled-mode enhancement, infinite wavelength propagation, zeroth-order resonance, full-space leaky-wave radiation – have drawn huge interest in both the physics and engineering communities since their first experimental demonstration in 2000.

As all novel ideas in science and technology, metamaterials have raised considerable controversies, some believing that they represent a mode topic restricted to academic studies, others seeing in them a revolutionary paradigm for tomorrow's electrodynamics and optics.

This presentation attempts to address the question on the actuel potential of metamaterials in a critical manner and tries to provide a vision of the future directions of research and industrial developments in this field. First, it shows that, in contrast to typical mode topics rediscovering ideas established in the past or borrowing ideas from other fields without scientific grounds, metamaterials are based on some fundamentally novel and useful concepts. Next, it shows a number of practical microwave applications with superior performance and/or functionality compared to prior state-of-the-art microwave engineering solutions. Finally, it discusses the next generation of metamaterials in connection with most recent micro and nanotechnologies.

 

 

Speaker: Prof. Dr. Wolfgang Hoefer

University of Victoria
Department of Electrical and Computer Engineering
P.O. Box 3055 STN CSC
Victoria, B.C. V8W 3P6, Canada
Tel.: +1 (250) 721-6030, Sec: -8821
E-Mail: WHoefer@ECE.UVIC.ca

 

Topic: Multi-Level Modeling for Complex Microwave/High-Speed Design

 

Complex communication and information systems operating in the Gigahertz range often combine multiple analog and digital functions. The design of such systems must capture all electromagnetic effects and interactions that impact their performance. However, it is impossible to model such systems globally at the field and device levels. Therefore, designers must take a hierarchical approach (top-down design) by which the system is conceived at a high level of abstraction and in behavioral terms. The specifications for its functional components are formulated at the network or circuit level. They, in turn, define a physical structure that requires frequency- or time-domain electromagnetic field analysis. Once the functional components have been realized, their actual physical behavior must be analyzed or measured, including possible parasitic
interactions between them, and abstracted into realistic (as opposed to initially specified) behavioral models that accurately predict their impact on overall system performance (bottom-up verification). This methodology also addresses signal integrity, packaging, interconnects, electromagnetic compatibility (EMC), and thermal issues.

The purpose of this lecture is to familiarize our members with evolving design approaches for systems of large technological and functional complexity, and to demonstrate how microwave modeling and design practices can be integrated into a wider flexible multi-level modeling environment. Techniques for interfacing models at the behavioral, network, circuit and field levels will be demonstrated. They range from order reduction of field models to the coupling of field- and circuit solvers, extraction of equivalent circuits from field solutions and measurements, behavioral representation by neural networks, and the linking of electromagnetic and thermal solvers. The key is to describe different parts of a complex structure by the most appropriate model of lowest possible order, while maintaining a two-way correspondence between functional behavior and physics across the modeling hierarchy.

 

 

Speaker: Prof. Zhizhang (David) Chen 

Dalhousie University
Department of Electrical and Computer Engineering
1360 Barrington St.
Halifax, Nova Scotia
Canada B3J 2X4
Tel.: +1 (902) 494-6042, Secretary: -3996
E-Mail: z.chen@dal.ca
Web: http://myweb.dal.ca/zdchen/

 

Topic: Unification of Numerical Methods: A General Mathematical Framework for Derivations and New Scheme Developments

 

Electromagnetic field modeling and simulation have become increasingly popular for accurate designs in modern electrical and electronic engineering, thanks to the drastic advances in computer technology. They have been applied in many areas, in particular in industrial designs where the reduction in the number of design cycles or product's time-to-market has become very critical in a global competitive environment. For instance, in antennas, most of the practical designs are now done with simulations using commercially available software packages before actual prototyping and testing. In high-frequency electronic circuits, due to the fact that analyses based on simple circuit theory are no longer adequate, electromagnetic simulators are increasingly being used to improve design accuracy. In biomedical engineering, numerical simulations are often required to compute dosimetry in a biological body since an actual measurement is either difficult or impossible.


Many numerical methods have been developed so far for electromagnetic modeling and simulation. They present different approaches to the approximate solutions of the electromagnetic field governing equations, namely, Maxwell's equations. They include frequency-domain methods such as the finite-difference frequency-domain (FDFD) method, finite-element (FEM) method and the conventional method of moments (MoM), and the time domain methods such as finite-difference time-domain (FDTD) method, transmission-line-matrix (TLM) method, time-domain finite-element (TD-FEM) method, and time-domain integral formulations. On one hand, these methods have been proven to be effective in solving electromagnetic structure problems with their respective advantages and disadvantages. On the other hand, they appear to have been derived on different mathematical bases and their solution procedures also appear to be different from each other, presenting challenges and difficulty for students, beginners and even practitioners in understanding and applying them.

This lecture is intended to show otherwise: all the numerical methods can be generalized or derived with the method of the weighted residuals, or method of moments; As the result, an easy way to understand and apply numerical methods is presented and a new perspective on numerical methods and a new way to develop innovative numerical methods are shown. In particular, unifying concepts among numerical methods are described and based on the concepts emerging numerical methods such as meshless, hybrid and multilevel techniques are demonstrated.
 

 

Committee MTT-16: Microwave Systems

 

Committee Chair(s): Gregory Lyons, Tel: 781-981-4705, e-mail: g.lyons@ieee.org , Reinhard Knoechel, Tel: 49-431-880-6150, e-mail: rk@tf.uni-kiel.de

 

Speaker:

 

Dr. Roger Kaul.

P.O. Box 213

Sykesville, MD 21784

Tel: 410-552-5289

Fax: 301-394-2525

e-mail: rkaul@ieee.org

 

Topic: Receiver Protectors for Intense EM Fields

 

Abstract: Land sea and airborne microwave receivers will experience increasing levels on intense electromagnetic fields. This presentation describes the current state-of-the-art in gaseous and solid-state receiver protectors, and projects future developments.

 

Speaker:

 

Dr. Christopher P. Silva

The Aerospace Corporation

El Segundo, California

Tel: 310-336-7597

Fax: 310-336-0620

 e-mail: chris.p.silva@aero.org

 

Topic: State-of-the-Art Time-Domain Measurement and Modeling Techniques for Nonlinear Components and Systems  

 

Abstract: This presentation introduces and describes new and highly accurate time-domain measurement and modeling techniques applicable to nonlinear communications components and systems with bandwidths ranging to several GHz. An overview and comparison of time-domain versus frequency-domain measurements as they pertain to nonlinear components and systems will first be given. The development of baseband time-domain measurement techniques and system will next be covered that provides state-of-the-art measurement accuracies of time-domain waveforms critical to design verification, model construction/validation with operational modulated signals, and system troubleshooting. A survey of some common frequency-domain blackbox modeling approaches will then be described, followed by the introduction of a new systematic approach, called the poly-spectral method, that is based on the time-domain input/output measurements involving operational modulated signals. A more detailed summary of this talk is available upon request. 

 

Speaker:

 

Bruce Kopp

DPM Consulting

bkopp@dpmconsulting.com

410-992-4278

 

Topic: Transmit/Receive Modules for Phased Array Antennas

 

Abstract: Phased array antennas provide a significant improvement in revisit rate in comparison to mechanically rotated antennas. This is of particular importance for RADAR applications, and phased array antennas are typically utilized for high performance RADAR applications of current interest. Transmit/receive (T/R) modules play a significant role in determining the performance, reliability, and cost of a phased array antenna. T/R modules also encompass a diverse set of technologies including semiconductors, packaging, and automated assembly and also present significant technical challenges. This presentation will discuss performance, cost, and reliability challenges associated with T/R modules along with associated emerging technologies.

 

 

 Speaker:

 

Reinhard Knoechel

University of Kiel

Technische Fakultat

Germany

rk@tf.uni-kiel.de

49-431-880-6150

 

Topic: Microwave Sensors for Industrial Applicattions

 

Abstract: Microwave sensors find a continuously increasing number of applications for in-line sensing of materials properties and industrial process control. The first part of the talk will focus on the implantation of the latest two-parameter microwave sensors for the rapid determination of material properties. Two classes of two-parameter sensors will be presented. In the second part of the talk multi-parameter sensors will be introduced. With such sensors, dielectric spectra of materials are interrogated over wide frequency ranges at distinct spot frequencies. The most advanced sensors of the latter kind working either in frequency domain or in time domain, and based on ultra-wideband (UWB) bandwidths, will be shown and special applications will be presented.

 

Speaker:

 

Arne F. Jacob

Hamburg University of Technology

Hamburg, Germany

jacob@tuhh.de

Tel: +49-40-42878-3019

Fax: +49-40-42878-2755

 

Topic: Integrated Millimeter-Wave (Sub-) Systems for Future Satellite Communications

 

Abstract: The advent of Ka-band satellites for broadband mobile communications calls for advanced system architectures, technologies, and designs for both the ground and the satellite segment. In its first part the presentation addresses the particular challenges associated with the realization of compact millimeter-wave terminal antenna systems relying on digital beam forming. The second part deals with the integration and the space qualification of various on-board (sub-)systems using advanced 2.5D (LTCC) packaging technologies.

 

 

Committee 17: HF/VHF/UHF Technology

 

Committee Chair(s):  Richard Campbell, Tel: 503-601-1916, e-mail: kk76@ieee.org , Vice Chair: John Walker, Tel: 44-1455-556565, e-mail: jwalker@semelab.co.uk

 

Speaker:

 

Prof. Jozef W. Modelski, Inst. Of Radioelectronics, Warsaw University of Technology

Tel: 48-22-8253929 or 48-22-8256555

Fax: 48-22-8255248 or 48-22-8256555

e-mail: j.modelski@ire.pw.edu.pl

 

Topic: Microwave Phase Modulators and Shifters

 

Abstract: This lecture presents an overview of digital and continuous phase modulators and shifters with semiconductor (varactor diodes, pin diodes, FETs) and ferrite elements. Design methods and optimization procedures of different shifter structures for receiving: maximum shifter bandwidth, minimum parasitic amplitude modulation, high efficiency, maximum linearity of phase characteristics (for analog phase shifters) are given, particularly, for varactor diode analog and pin diode digital modulators. Practical realizations in different technologies and in different frequency bands are also presented     

 

Speaker:

 

T. Boles, M/A COM Semiconductor Business Unit

Tel: 781-564-3386

Fax: 781-564-3141

e-mail: bolest@amp.com

 

Topic 1: A Fully Monolithic HMIC Low Noise Amplifier

 

Abstract: A two/three stage monolithic silicon low noise amplifier has been designed utilizing SPICE modeling techniques. The circuit design architecture is based on high frequency, small signal BJT's, consisting of a common emitter stage at the input and a Darlington configured pair at the device output.

 

This paper will also cover the techniques and technology required to fabricate these monolithic high frequency circuits.

 

Topic 2: Design of Darlington Based Silicon MMIC Gain Blocks

 

Abstract: In many wireless and CATV applications, the use of silicon MMIC gain blocks have replaced discrete devices for low level gain stages and medium power amplification. The gain blocks have become quite cost competitive in volume when compared with the discrete transistors and have the advantage of providing flat power gain while being matched to the required circuit impedances. Design concepts are presented.

 

Speaker:

 

Dr. R. Caverly, Villanova University

Tel: 610-519-5660

Fax: 610-519-4436

e-mail: r.caverly@ieee.org

 

Topic: RF and Microwave Solid-State Control

 

Abstract: A variety of semiconductor technologies is now available for RF and microwave control. This talk will address such control technologies as PIN diodes and FET-based elements and issues related to the choice of control technology for particular applications. Control design considerations will also be discussed.

 

Speaker:

 

Dr. S.C. Cripps, Hywave Associates

Tel: 44-0-1460-234296

Fax: 44-0-1460-234296

e-mail: Steve.Cripps@BTInternet.com

 

Topic: High Efficiency Amplification of Variable Envelope Signals for Modern Wireless Communications Systems: Doherty and Chireix Re-Visited

 

Abstract: Modern wireless systems pose severe challenges for the RF PA designer, both at the mobile end, where efficiency is paramount, and at basestation, which may require multi-channel operation. Most systems use phase-shift modulation but usually have accompanying envelope variations in order to limit channel bandwidth. This talk will review the basic theory of the Doherty technique and the Chireix outphasing method for designing such future systems.

 

Speaker:

 

Dr. F.H. Raab, Green Mountain Radio Research

Tel: 802-655-9670

Fax: 802-655-9760

e-mail: f.raab@ieee.org

 

Topic 1: High-Efficiency RF-Power Amplifiers

 

Abstract: This talk is an overview of techniques for high-efficiency RF power amplification. First, some basic concepts about transistors and the concept of average efficiency are introduced. The characteristics of conventional amplifiers (classes A, B, and C) are then reviewed. The principles, demonstrated achievements, and practical limitations of RF-power amplifiers operating in class D, class E, and class F are then discussed. The talk concludes with a discussion of techniques for linear amplification using high-level amplitude modulation via a class-S modulator and the Kahn envelope-elimination and restoration technique.

 

Topic 2: Kahn-Technique Transmitters

 

Abstract: The Kahn envelope-elimination and restoration (EER) technique allows efficient but nonlinear RF amplifiers to be used to implement a high-efficiency linear transmitter. Fundamentally, a narrowband RF signal is regarded as simultaneous amplitude and phase modulation. The phase-modulated carrier is amplified efficiently by a chain of nonlinear RF amplifiers and the envelope is restored by high-level amplitude modulation of the final amplifier. This talk reviews the concept of average efficiency and then reviews the principles and requirements for the EER technique.

 

Topic 3: Low-Cost High-Efficiency HF Power Amplifiers

 

Abstract: Recently marketed "low-cost" RF-power MOSFETs in plastic TO-247 packages are capable of generating significant RF power at high efficiency in single-frequency RF applications. This paper explores the use of these MOSFETs in broadband power amplifiers. PAs operating in classes D, DE, and E are compared.

 

Speaker:

 

N.O. Sokal, Design Automation, Inc.

Tel: 781-862-8998

Fax: 781-862-3769

e-mail: nathan.sokal@compuserve.com

 

Topic 1: One (1) hour talk "Class E Switching-Mode High-Efficiency Power Amplifiers - from RF to Microwave"

 

Abstract: Class E power amplifiers achieve significantly higher efficiency than for conventional Class B or C. Class E operates the transistor as an on/off switch and "shapes the voltage and current waveforms" to prevent simultaneous high voltage and high current in the transistor; that minimizes the power dissipation, especially during the switching transitions.  In the published low-order class-E circuit, a transistor performs well at frequencies up to about 70% of its frequency of good class-B operation.

 

Topic 2: Four (4) hour Tutorial Lecture "RF Power Amplifiers, Class A through S - How They Operate, and When to Use Each"

 

Abstract: With at least ten lettered classes of RF power amplifiers, and several combinations of these classes, many engineers are confused about RF power amplifiers. The complexity of the subject is compounded by the fact that RF power transistor acts either as a high-resistance current source or as a low-resistance switch, or - in some amplifiers - as a high-resistance current source during part of the "on" interval and as a low-resistance switch during another part of the "on" interval (mixed-mode operation). The circuit topology does not define unambiguously the transistor operating mode or the amplifier class of operation.

 

 

Committee MTT-18: Microwave Superconductivity

 

Committee Chair(s): Jeffrey Pond, Tel 202-767-2862, e-mail: j.m.pond@ieee.org , Charles Wilker, Tel: 302-499-5015, e-mail: charles.wilker@usa.dupont.com

 

Speaker: Contact Committee Chairs

 

 

Committee MTT-19: Microwave Technology Business Issues

 

Committee Chair(s):  Ferdo Ivanek, Tel: 650-329-8716, e-mail: ivanek@stanford.edu 

 

Speaker: Dr. Mike Golio

Editor-in-chief,  IEEE Microwave Magazine

Tel: 480-615-6990

 e-mail:  m.golio@ieee.org

 

Topic:  Engineering Your Retirement

 

Abstract:  Engineering Your Retirement is designed to help technical professionals (engineers and scientists) develop a plan for their safe and successful retirement. The presentation examines important questions such as, "How much money will I need to retire?," "How long will it take for me to accumulate it?," and many others. The audience will be informed of free tools and information needed for someone to answer those questions and to achieve a comfortable retirement on their own schedule. Issues that must be considered to achieve a successful retirement including health care, budgeting, inflation, portfolio requirements, investment allocations, selecting a place to live, mortgage payoff, wills, powers of attorney, etc. are examined. 

 

 

Committee MTT-20: Wireless Communication

 

Committee Chair(s): Upkar Dhaliwal, Tel: 858-926-5839, e-mail: upkar@ieee.org, Vice-Chair: Edward Niehenke, Tel: 410-796-5866, E-mail: e.niehenke@ieee.org 

 

Speaker:

 

Dr. Rainee N. Simons, NASA Gleen Research Center Dynacs  Group

Tel: 216-433-3462

Fax:216-433-8705

e-mail: Rainee.N.Simons@grc.nasa.gov

 

Topic: Recent Advances in Printed Antennas for Wireless and Satellite Communications

 

Abstract: The talk commences with a brief overview of printed antenna concepts. The overview would include basic types of printed radiators, such as, microstrip patch, strip, and slot antennas. Second, feeding techniques, such as, direct feed, proximity feed and aperture coupled feed will be discussed. Examples of feed systems using microstrip, slotline or coplanar waveguide will be presented. Third, techniques to realize dual polarization and polarization will be presented.

 

 

Committee MTT-21: MEMs

 

Committee Chair(s):  Thomas Weller. e-mail: weller@eng.usf.edu , Scott Barker, e-mail: barker@virginia.edu 

 

Speaker:

 

Dr. J. Robert Reid, Antenna Technology Branch, Air Force Research Laboratory

Hanscom AFB, MA   01731

Tel: (781) 377-1077

Fax: (781) 377-1074

email: James.Reid@hanscom.af.mil

 

Topic: Three Dimensional Millimeter Wave Circuits

 

Abstract:: This presentation covers the design and realization of microwave and millimeter-wave circuits using three dimensional metal micro-machining processes.  Circuits fabricated using these process have several advantages over competing technologies.  One particularly important advantage is the ability to realize TEM transmission lines that operate from DC to over 300 GHz and can be arbitrarily routed on a substrate.  These lines are fully enclosed providing high isolation even at millimeter wave frequencies.  A second advantage is the ability to accurately reproduce a wide variety of circuits including couplers and filters.  Topics covered in this presentation will include the fabrication processes, circuit design and implementation, and the advantages and disadvantages of this new technology. 

 

Speaker:

 

Dr. Ronald G. Polcawich, US Army Research Laboratory, Adelphi, MD 20783

Tel: 301-394-1275

e-mail: rpolcawich@arl.army.mil

 

Topic: RF MEMS Devices Using Piezoelectric Thin Films

 

Abstract: Piezoelectricity is an extremely important physical phenomenon and in ceramic form has been widely used in sensors, actuators, and transducers.  Piezoelectric thin film applications have been limited in the past with a majority of efforts emphasizing lower performance materials such as ZnO and AlN because of their ability to be easily integrated with standard microelectronics fabrication.  However, a special class of functional materials, ferroelectrics, possesses a tremendous potential in new MEMS devices and has seen increasing research interest in recent years.  Of particular interest is the use of lead zirconate titanate (PZT) thin films for actuators.  Recently, PZT actuators have been successfully integrated to yield RF MEMS switches capable of operating at less than 10 volts.

 

Speaker:

 

N. Scott Barker, University of Virginia,  Charlottesville, VA

e-mail: barker@virginia.edu

Tel: 434-924-6783

 

Topic: Distributed RF-MEMS Circuits

 

Abstract: In order to reduce the packaging requirements for RF-MEMS devices we have developed a switched capacitor technology with minimal contact. Although this switched capacitor design results in a reduced capacitance ratio in the range of 5-10 we have also developed circuit designs for phase shifters and tunable matching networks (and the same can be done with filters) which do not require a capacitance ratio over 10. In addition to packaging, another Achilles' heel for RF-MEMS has been the uncertainty in pull-down voltages due to residual stress that is built into the beam during fabrication. We have successfully identified the major contribution of this stress to thin-film gold beams and are now able to routinely fabricate thin-film (< 1 micron thick) gold cantilevers with almost zero tip deflection upon release, and fixed-fixed beams with a pull-down voltage that nearly matches the analytical model without the need for adding on an unknown stress term.

 

 

Speaker:

Prof. Shiban K Koul, Indian Institute of Technology Delhi, India; Tel: +919811209829; Fax:: +91-11-26863165

            e-mail: s.k.koul@ieee.org    or   shiban_koul@hotmail.com

 

  Topic: Micromachined Microwave and Millimeter Wave Circuit Design

 

Abstract: Micromachining has been applied to microwave and millimeter wave field to create low loss and high performance passive/active components and antennas. In this talk, starting from Modeling of transmission lines and discontinuities, design procedure to realize passive components will be presented. Next, design, modeling and fabrication of different types of micromachined antennas will be described.  Methodology for the design, development and fabrication of RF MEMS switches on GaAs will then be presented. The schemes for developing reconfigurable RF MEMS circuits using either variable capacitors or RF MEMS switches will be discussed. The reconfigurable circuits include: a band pass filter, band stop filter, high isolation switch and a patch antenna.

 

Committee MTT-22: Signal Generation and Frequency Conversion

 

Committee Chair(s): Edmar Camargo, Tel: +1 408-580-7724, e-mail: E.Camargo@GMail.com, or ecamargo@ieee.org

                                   Carlos Saavedra, Tel +1 613-533-2807, e-mail: Carlos.Saavedra@QueensU.Ca

 

Speaker: Contact Committee Chair

 

 

Committee MTT-23: RFIC

 

Committee Chair(s): Natalino Camilleri, Tel: 408-252-6165, e-mail: natalinoc@yahoo.com

                                 

 

Speaker: Contact Committee Chair

 

Committee MTT-24: RFID TECHNOLOGIES

 

Committee Chair: Manos Tantzeris, Tel: 404-385-6006, e-mail: etentze@ece.gatech.edu

 

Speaker:

 

Manos M. Tentzeris
Professor, School of ECE
Georgia Institute of Technology
Atlanta, GA 30332-250
Phone: 404-385-6006 , FAX  : 404-894-0222
Homepage: http://www.ece.gatech.edu/~etentze

 

Topic: Inkjet-Printed Electronics

 

Abstract: In this talk, inkjet-printed UHF and microwave circuits fabricated on paper substrates are investigated for the first time as an approach that aims for a system-level solution for fast and ultra-low-cost mass production. First, the RF characteristics of the paper substrate are presented by using the microstrip ring resonator in order to characterize the relative permittivity and loss tangent of the substrate at the UHF band for the first time reported. A UHF RFID tag module is then developed with the inkjet-printing technology, proving this approach could function as an enabling technology for much simpler and faster fabrication on/in paper. Simulation and well-agreed measurement results, which show very good agreement, verify a good performance of the tag module. In addition, the possibility of multilayer RF structures on a paper substrate is explored, and a multilayer patch-resonator bandpass filter demonstrates the feasibility of ultra-low-cost 3-D paper-on-paper RF/wireless structures. Various examples of inkjet-printed nanostructures (e.g. CNT's) on paper as well as benchmarking with other flexible materials (e.g., LCP) will conclude the talk.

 

 

EUROPEAN MICROWAVE LECTURER

(Jointly sponsored by MTT-S and EuMA)

 

Lecturer

 Lecture Title

 Lecturer e-mail

Ovidio Bucci

Electromagnetic inverse problems: quantifying, qualifying and retrieving the available information.

bucci@unina.it
Peter Russer

Network Methods in Electromagnetic Field Computation

Russer@tum.de
Sergei Tretyakov

Possibilities of Cloaking and Invisibility at Microwaves

Sergei.Tretyakov@tkk.fi

 

Lecture: Electromagnetic inverse problems: quantifying, qualifying and retrieving the available information.

 

Speaker: Ovidio Bucci, Professor of Electromagnetic Fields, Faculty of Engineering, University of Naples Federico II, bucci@ina.it

 

Abstract: Electromagnetic inverse problems occurs in many branches of applied science, as, f. i., antenna design and diagnostics, non-destructive testing, underground and intra-walls detection, biomedical diagnostics and so on. By their very nature, these problems are usually ill-posed and often non-linear, which makesthe development of effective and reliable inversion algorithms a very hard task. To face this task in a sound way, a necessary prerequisite is to answer the following points:

  • what is the maximum amount of information which can be actually extracted from the (scattered or radiated) field?
  • how can we effectively collect this information?
Only once these question have been answered, we can face the last point:
  • how can we reliably and effectively retrieve an amount of information concerning the radiating or scattering system equivalent to that contained
     in the data?

The lecture is mainly dedicated to answer, under a general setting, the first two points, taking into account the incompleteness and inaccuracy of any real measurement process. However, in the final part, some recent approaches to the last point are presented and open problems and possible pathways are briefly discussed.

 

 

 

Lecture: Network Methods in Electromagnetic Field Computation

 

Speaker: Peter Russer, Professor, Head of the Institute for High Frequency Engineering, Munich University of Technology,

Arcisstrasse 21, Munich D-80333, Germany, Russer@tum.de

 

Abstract:  With increasing bandwidths and data rates of modern electronic circuits and systems, electromagnetic wave phenomena that in the past were in the domain of the microwave engineer, are now becoming pivotal in the design of analog and digital systems. Design, modeling and optimization of high-speed analog and digital electronic circuits and systems, photonic devices and systems, of antenna, radar, imaging and communications systems, among other applications, require the application of advanced tools in computational electromagnetics.

Compared with a network-oriented design a field-oriented design of circuits and systems requires a tremendously higher computational effort. The availability of steadily increasing computing facilities has not reduced the demand for efficient methods of electromagnetic field computation. This is readily understandable especially in the highly competitive design of broadband and high-speed electronic components. The demands for volume, weight and cost reduction foster a compact and complex design of electromagnetic structures yielding a high computational effort in electromagnetic modeling.

Network-oriented methods applied to electromagnetic field problems may contribute significantly to the problem formulation and solution methodology. Whereas in field theory the three-dimensional geometric structure of the electromagnetic field has to be considered, a network model exhibits a plain topological structure. Network models relate integral quantities like voltage and current, which at lower frequencies, can be defined uniquely by line integralsover electric and magnetic field quantities. An essential point is that network models can also apply to electromagnetic structures at higher frequencies when generalized voltages and currents are introduced by a proper definition of integral field quantities. One particular example of thisnprocedure realized in Method of Moments (MoM) where the coefficients of the expansions of electric and magnetic fields can be considered as generalized voltages andcurrents and the linear equations relating these quantities as network equations.

In network theory systematic approaches for circuit analysis are based on the separation of the circuit into the connection circuit and the circuit elements. The connection circuit represents the topological structure of the circuit and contains only interconnects, including ideal transformers. Applying a network description electromagnetic structures can be segmented into substructures. These substructures define the circuit elements and the set of boundary surfaces between the substructures define the interconnection network. Canonical Foster equivalent circuits can represent lossless structures in sub-domains. Canonical Cauer networks can describe radiation modes. The lumped element models can be obtained by analytic methods, i.e. via Green's function or mode matching approaches or by numerical methods techniques (Transmission Line Matrix Method or Transverse Wave Formulation) in connection with system identification techniques.

The network approach allows a systematic introduction of hybrid methods. Furthermore, network formulations are well suited for the application of model order reduction methods. Analytic and numerical methods and examples of their application are discussed. Network methods are applicable in connection with the main analytic and numerical methods for electromagnetic field modeling and provide a large variety of tools for efficient modeling of complex electromagnetic structures.

 

 

Lecture:  Possibilities of Cloaking and Invisibility at Microwaves

 

Speaker: Sergei Tretyakov, Professor of Radio Engineering, Helsinki University of Technology (TKK), Sergei.Tretyakov@tkk.fi

 

Abstract: Recently, the topic of making objects "invisible" for electromagnetic radiation has gained much attention, following new ideas of using engineered electromagnetic materials with unusual properties for this purpose. This lecture provides a comparative review of the recent developments in this field and discusses the potentials of utilizing these ideas for various microwave and antenna applications. The lecture starts from a review of the notions of invisibility and cloaking and their relations to the classical stealth technologies of reducing radar cross section of targets. Next, we make a historical overview of earlier approaches to techniques allowing reduction of scattering from various objects. Recently proposed solutions for cloaking of objects are reviewed and compared, with the emphasis on the fundamental limitations of their performance. This topic is closely linked to the problem of creating of artificial materials with engineered electromagnetic properties. In particular, materials with equal values of relative permittivity and permeability are of interest. The lecture presents our recent developments of such materials based on mixtures of spiral inclusions and their use for cloaking applications. Furthermore, we discuss the use of electrically dense meshes of transmission lines as cloaking devices. It is shown how new cloaking techniques can be used for applications not necessarily related to cloaking of objects, for instance in new microwave lens antennas or in the design of matched absorbing layers. 

 

 

 

 

Reimbursement for Speakers Bureau Expenses   (Control-Home to return to top)

 

-          Following the talk, the Speaker completes an After-Talk Report, plus an IEEE Expense Form and sends them, together with copies of the Chapter Invitation and MTT-Committee approval, to the TCC Administrator:

Dr. Larry Whicker, Tel: 704-841-1915, lrwassoc@carolina.rr.com

 

Following TCC Review/Approval:

-          Copies are provided to the ADCOM Treasurer for review/approval.

-          After review/approval of the submitted material, the documents are forwarded to the IEEE Financial Office for payment. (Payment may take up to 2 months.)

 -          Total payment of expenses is limited to $ 2,000 per year per Speaker.

 

 

 END