MTT TCC Speakers Bureau
Updated 29 June, 2009
NEW CATEGORY (2009)
(Jointly sponsored by MTT-S and EuMA)
NEW TECHNICAL COMMITTEE (2009)
(Also see MTT-S Distinguished Microwave Lecturers. Click here.)
Contact Larry Whicker and Richard Snyder for changes or updates.
Committee Chairs, Speakers, and Abstracts are listed below the table.
Click the highlighted Topical Area in the table to go to Abstracts for that Topical Area.
Control-Home to return here.
Click Speaker's e-mail address to send to Speaker.
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TOPICAL AREA |
Speaker |
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MTT-1 Computer Aided Design |
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Terahertz Technology Fact or Fiction |
Dr. Chris Snowden |
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Physical Models for Microwave and Millimeter- Wave CAD |
Dr. Chris Snowden |
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Simulation and Modeling of Electrically Large Microwave and Millimeter-Wave Systems |
Dr. Michael Steer |
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Microwave CAD Using Space Mapping Technology |
Dr. John W. Bandler |
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Mtt-2 Microwave Acoustics |
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Wireless, Passive Surface Acoustic Wave Tags and Sensors |
Dr. Donald C. Malocha |
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RF Front-Ends for Multi-Mode, Multi-Band Cellular Phones |
Dr. Clemens Ruppel |
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SiP/SoC Integration of RF SAW/BAW Filters |
Dr. Ken-ya Hashimoto |
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Thin Film Bulk Acoustic Wave Resonators and Filters |
Dr. Ken Lakin |
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Wireless SAW-Based Sensing and Identification |
Dr. Leonhard M. Reindl |
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Mtt-3 Microwave Photonics |
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Techniques and Applications of Analog Optical Links |
Dr. Charles Cox, III |
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Fiberoptic Links for Satellite Communications |
Dr. Afshin S. Daryoush |
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Optoelectric Ultra-Wideband RF/Wireless Communications |
Dr. Chi H. Lee |
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Synergy of Optical and Microwave Technologies |
Dr. Tibor Berceli |
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Mtt-4 Terahertz Techniques |
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Terahertz Technology in Outer and Inner Space |
Dr. Peter H. Siegel |
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Minimizing Power Amplifier Memory Effects, or
Alternate: Linearization: Reducing Distortion in Power
Amplifiers |
Dr. Allen Katz |
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Design and Performance of Microwave and
Millimeter-wave High Efficiency Power Amplifiers |
Dr. James Komiak |
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RF/DSP Co-Designed Power Amplifiers/Transmitters
for Advanced Wireless and Satellite Applications |
Dr. F. M. Ghannouchi |
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An Enabling Technology for 3G+ Systems |
Dr. F M. Ghannouchi |
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RF/Analog Circuit Design for Wireless Communication Networks |
Dr. M. Madihian |
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| Millimeter Wave Integrated Circuit Techniques and Technology | Dr. Shiban K. Koul, | S.K.Koul@IEEE.Org |
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Contact Committee Chair |
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Analysis and Design of Dielectric Resonators and Filters |
Dr. Chi Wang |
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Present and Future Filter Design Philosophy: Paradigm Shift in Progress |
Dr. R.V. Snyder |
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Computing and Enhancing
Power Handling in Bandstop Filters |
Dr. R.V. Snyder |
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Waveguide Filters for
Satellites |
Prof. V. E. Boria-Esbert |
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Contact Committee Chairs |
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Terahertz Technology in Outer and Inner Space |
Dr. Peter Siegel |
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MTT-11Microwave Measurements |
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Non-Linear Measurements:
From the Power Meter to the LSNA |
Jan Verspechi and
Andrea Ferrero |
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High-Frequency Measurements of Dielectric Substrate Materials |
Dr. Michael D. Janezik, |
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Measurements for Modeling |
Dr. Dominique Schreurs |
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| All You Need to Know About RF & Microwave Coax Connectors But Were Afraid toAsk | Nick Ridler | nick.ridler@ieee.org |
| Evaluating Errors and Uncertainties in RF & Microwave Measurements | Nick Ridler | nick.ridler@ieee.org |
| Microwave Fiber-Optic Links: Design and Measurement Issues | Dr. Stavros Iezekiel | iezekiel@ucy.ac.cy |
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T/R Modules Using 3D and
SIP Packaging |
Rick Sturdivant |
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Liquid Crystal Polymer for RF and Millimeter Wave Multi-layer Packages and Modules |
Anh-Vu Pham |
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MTT-13 Microwave Ferrites |
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Ferrite Phase Shifters |
Dr. Charles R. Boyd Jr. |
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Ultra Low Noise, InP Field Effect Transistors Radio Astronomy Receivers: State -of-the - Art |
Dr. Marian Pospieszalski |
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Noise Analysis in Field Transistors Operating Under Small or Large Signal Operation |
Dr. Francois Danneville |
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MTT-15 Microwave Field Theory |
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Leaky Modes and High-Frequency Effects on Microwave Integrated Circuits |
David R. Jackson |
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Geometrical Concepts in Teaching Electromagnetics |
Prof. Peter Russer |
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| Metamaterials: Blue-Sky Chimera or Revolution in Microwaves and Photonics | Prof. Christopher Caloz | christophe.caloz@polymtl.ca |
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Multi-Level Modeling for Complex Microwave/High-Speed Design |
Prof. Wolfgang Hoefer |
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| Unification of Numerical Methods: A General Mathematical Framework for Derivations and New Scheme Developments | Prof. Zhizhang Chen | z.chen@dal.ca |
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MTT-16 Microwave Systems |
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Receiver Protectors for Intense EM Fields |
Dr. Roger Kaul |
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State-of-the-Art Time-Domain Measurement and Modeling Techniques for Nonlinear Components and Systems |
Dr. Christopher P. Silva |
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Microwave Sensors for Industrial Applications |
Dr. Reinhard Knoechel |
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Transmit/Receive Modules
for Phased Array Antennas |
Bruce Kopp |
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Integrated Millimeter-Wave (Sub-) Systems for
Future Satellite Communications |
Dr. Arne F. Jacob |
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MTT-17 HF/VHF/UHF Technology |
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Microwave Phase Modulators and Shifters |
Jozef W. Modelski |
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A Fully Monolithic HMIC Low Noise Amplifier |
T. Boles |
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Design of |
T. Boles |
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RF and Microwave Solid-State Control |
Dr. R. Caverly |
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High Efficiency Amplification of Variable Envelope Signals for Modern Wireless Communications Systems: Doherty and Chireix Re-Visited |
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High-Efficiency RF-Power Amplifiers |
Dr. F.H. Raab |
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Kahn-Technique Transmitters |
Dr. F.H. Raab |
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Low-Cost High-Efficiency HF Power Amplifiers |
Dr. F.H. Raab |
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Class E Switching-Mode High-Efficiency Power Amplifiers - from RF to Microwave (1 hr.) |
N.O. Sokal |
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RF Power Amplifiers, Class A through S - How They Operate, and When to Use Each (4 hr. Tutorial) |
N.O. Sokal |
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MTT-18 Microwave Superconductivity |
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INACTIVE |
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Engineering Your Retirement |
Dr. Mike Golio |
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MTT-20 Wireless Communication |
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Recent Advances in Printed Antennas for Wireless and Satellite Communications |
Dr. Rainee N. Simons |
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MTT-21 MEMs |
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Three Dimensional Millimeter Wave Circuits |
Dr. J. Robert Reid |
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RF MEMS Devices Using Piezoelectric Thin Films |
Dr. Ronald G. Polcawich |
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Distributed RF-MEMS Circuits |
Dr. N. Scott Barker |
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| Micromachined Microwave and Millimeter Wave Circuit Design | Dr. Shiban K. Koul, | S.K.Koul@IEEE.Org |
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Contact Committee Chair |
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MTT-23 RFIC |
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Contact Committee Chair |
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| MTT-24 RFID Technologies | ||
| Inkjet-Printed Electronics | etentze@ece.gatech.edu | |
MTT- TCC-Speakers Bureau
Committee MTT- I: Computer Aided Design
Committee Chair: Michal Odyniec, Tel: 510-524-8373, e-mail: m.odyniec@ieee.org
Speaker:
Dr. Chris Snowden,
Tel: 44-113-233-2001
Fax:: 44-113-233-2032
e-mail: c.m.snowden@elec-eng.leeds.ac.uk
Topic: Terahertz Technology Fact or Fiction
Abstract: The interest in exploring the spectrum above 100 GHz and below 10 THz is limited by the availability of suitable solid-state technologies. This presentation addresses the present state-of-the-art for active devices and integrating technologies in the range 100 GHZ to 2 THz.
Alternate Topic: Physical Models for Microwave and Millimeter- Wave CAD
Abstract: State-of-the-art modeling techniques for microwave and millimeter-wave transistors are presented together with an outline of their application in process-oriented CAD. The presentation will consider MESFET, HBT, and pHEMT devices in the frequency range 900 MHz to 140 GHz.
Speaker:
Dr. Michael Steer,
Tel: 919-515-5191
Fax: 919-513-1979
e-mail: m.b.steer@ieee.org
Topic: Simulation and Modeling of Electrically Large Microwave and Millimeter-Wave Systems
Abstract: Many of the grand challenges in the engineering of microwave and millimeter-wave circuits concerns the complexity of large systems with interacting electromagnetic fields, circuits and thermal effects. This is particularly true with power generation systems where thermal effects significantly affect stability and ultimately power handling capability.
Speaker:
Dr. John W. Bandler, Bandler Corp.,
Tel: 905-628-9671
Fax: 905-628-1578
e-mail: j.bandler@ieee.org
Topic: Microwave CAD Using Space Mapping Technology
Abstract: Space mapping optimization intelligently links "coarse" and "fine" models of different complexities, e.g., full-wave electromagnetic simulations and empirical circuit-theory based simulations, to accelerate iterative design optimization of engineering structures. It is a simple CAD methodology which closely follows the traditional experience and intuition of microwave designers. The exploitation of properly managed space mapping models promises significant efficiency in engineering design optimization practices.
Committee: MTT-2 Microwave Acoustics
Committee Chair(s): Clemens Ruppel, Tel: 43-732-2468-9710, e-mail: cc.ruppel@ieee.org, Robert Weigel, 43-732-2468097, e-mail: r.weigel@ieee.org
Speaker:
Dr. Donald C. Malocha, Univ. of Central, FL
Tel: 407-823-2414
Fax: 407-823-5835
e-mail: d.malocha@ieee.org
Topic: Wireless, Passive Surface Acoustic Wave Tags and Sensors
Abstract:: Surface acoustic wave (SAW) technology can provide wireless, passive RF ID tagging and sensors. There are various embodiments using frequency and time diversity, and coded spread spectrum techniques, to meet different tagging and sensor applications. New research has shown that single frequency and multi-frequency CDMA tags can be used in a wide variety of passive wireless, multi-tag, space and commercial applications. This talk will discuss the current research and technology used for SAW yags and sensors, and describe current tag-sensor technology for space and other applications. The use of coding and spread spectrum techniques will show the advantageous of the technology and contrast to silicon RF tags.
Speaker:
Dr. Clemens Ruppel, EPCOS,
Tel: 49-89-636-53325
Fax: 49-89-63645396
e-mail: Clemens.ruppel@epcos.com
Topic: RF Front-Ends for Multi-Mode, Multi-Band Cellular Phones
Abstract: Cellular systems
worldwide are reaching maturity, especially the GSM system, accounting for more
than 60% of global (cellular) sales in 2004. At its introduction, only the 900
MHz band was used: a few years later the DCS band at 1.8 GHz was added. In
Europe and
This Talk addresses components for these types of systems. SAW and BAW filters are addressed. Please contact Dr. Ruppel for the expanded Abstract.
Speaker:
Dr. Ken-ya Hashimoto, Chiba University, Chiba Japan
Tel: 81-043-290-3318
Fax: 81-43-290-3320
e-mail: k.hashimoto@ieee.org
Topic: SiP/SoC Integration of RF SAW/BAW Filters
Abstract: RF filters employing surface or bulk acoustic wave (SAW/BAW0 have been mass produced and widely used in modern mobile communication equipment. Nowadays various analog functions are going to be merged into the baseband chip, and current concern is how you integrate remaining one, namely the RF front end. This is not a simple task because major RF Functional devices are based on non-Si technologies, and the RF section becomes complex rapidly for supporting multi-band and multi mode operation.
This talk discusses research trends of the SAW/BAW filters, focusing on possible integration into RF ICs.
First, modern SAW/BAW technologies are introduced, and it is shown hoe high performances are achievable by the use of current state-of-the-art technologies. Secondly, current front end modules are surveyed, and then it is discussed how they are going to be integrated with active circuit elements.
Speaker:
Dr. Ken Lakin, TFR Technologies,
e-mail: klakin@aol.com
Topic: Thin Film Bulk Acoustic Wave Resonators and Filters
Abstract: Microwave acoustic waves have wavelengths that are close to four orders of magnitude smaller than electromagnetic waves for the same frequency. Resonators and filters that are based upon propagating wave structures are accordingly significantly reduced in size. Bulk acoustic wave (BAW) resonators are the high frequency equivalent of the quartz crystal. BAW resonators and filters have been made over the frequency range of 300 MHz to over 12 GHz. These devices offer significant potential for wireless systems and RF instrumentation. This presentation will review the fundamentals of BAW technology, current and potential applications, and manufacturing issues.
Speaker:
Dr. Leonhard M. Reindl, IMTEK, Uniiversity of Freidberg, Germany
Tel: 49-761-203-7220
Fax: 49-761-203-7222
e-mail: reindl@iieee.org
Topic: Wireless SAW-Based Sensing and Identification
Abstract: In the recent years unwired SAW sensors and identification tags have come under notice with a growing number of publications and applications. In this presentation the operating principles of wireless passive, mostly SAW based identification marks and sensors are shown.
The whole radio based sensor system consists of read-out unit, comparable to a RADAR device, and a passive transponder, consisting of a surface acoustic wave (SAW) device wired to an antenna. The surface acoustic wave stores the read-out signal for a predefined period of time to suppress all environmental echo interferences. Physical or chemical effects may influence the propagation characteristics of the surface acoustic wave. Two fundamental devices allow storing and modulation of surface acoustic waves: the resonator, and the uniform or chirped delay line.
In the presentation, the transponder setup using a reflective delay line, resonator, or impedance sensor is discussed in detail, as well as the setup of the read out unit using a pulse of FMCW radar. Special emphasis is set on the achievable accuracy and on the sensitivity range. Several applications of such sensor systems and their state-of-the-art performance are presented by way of examples. An expanded version of the Abstract is available from Prof. Reindl.
Committee: MTT-3 Microwave Photonics
Committee Chair(s): Dieter Jaeger, Tel: 49-203-379-2341, e-mail: dieter.jaeger@uni-due.de, Dalma Novak, 410-590-3333, e-mail: d.novak@ieee.org
Speaker:
Dr. Charles Cox III, Photonic Systems, Inc.
Tel: 781-272-1819
Fax: 781-272-4654
e-mail: ccox@photonicsinc.com
Topic: Techniques and Applications of Analog Optical Links
Abstract: This presentation gives an introductory overview of analog links: direct and external modulation, figures of merit such as gain, noise figure and dynamic range and applications.
Speaker:
Dr. Afshin
S. Daryoush,
Tel: 215-895-2362
Fax: 215-895-1695
e-mail: daryoush@ece.drexel.edu
Topic: Fiberoptic Links for Satellite Communications
Abstract: Future generation of communication satellites are based on phased array antennas to generate over 100 simultaneous beams to provide communications services to mobile and fixed terminal users. The feed network operating at Ka-band is a major challenge and optical beam forming networks (OBFN) are considered as a desired technology.
Speaker:
Dr. Tibor Berceli, Professor, Technical University of Budapest
Tel: 36-1-463-4142
Fax: 36-1-463-3289
e-mail: berceli@nov.mht.bme.hu
Topic: Synergy of Optical and Microwave Technologies
Abstract: The lecture presents the combination of optical and microwave technologies offering new and better approaches for many applications. First the optical-microwave interaction principles are treated. That is followed by optical control of microwave circuits, optical-microwave mixing methods, processing of sub-carrier multiplexed optical signals, integration of wireless and optical techniques.
Speaker:
Dr. Chi H. Lee, Univ. of Maryland
Tel:
301-405-3739
Fax: 301-314-9281
e-mail: chlee@eng.umd.edu
Topic: Optoelectric Ultra-Wideband RF/Wireless Communications
Abstract: An optoelectronic ultra-wideband RF/wireless communications system is proposed. We refer this new technology as opto-impulse radio. Impulse modulation is a wireless transmission format for multipath and interference environments. It can provide a jam-resistant, high security, low-power RF communications link. Photoconductive (PC) switches are used as front-end elements in wireless impulse communications systems. Direct sequence code division is used to enhance an ultra-wideband impulse modulation communication system. Experimental results show an aggregate processing gain of 44 dB using a 750 MHz spreading bandwidth.
Committee MTT-4: Terahertz Techniques
Committee Chair(s):
Peter Siegel, Tel: 818-354-9089, e-mail: phs@catech.edu
, Koji Mizuno, Tel: 81-22-217-5515, e-mail: koji@riec.toku.ac.jp
Speaker:
Dr. Peter H. Siegel, JPL, Pasadena, CA
Tel: 818-354-9087
e-mail: phs@caltech.edu
Topic: Terahertz
Technology in Outer and Inner Space
Abstract: After more than
30 years of niche applications in the space sciences area, the field of Terahertz
Technology is entering a true Renaissance. While major strides continue to be
made in sub-millimeter wave astronomy and spectroscopy, the past few years have
seen an unprecedented expansion of Terahertz applications, components and
instruments. Broad popular interest in this frequency domain has emerged for
the first time, spanning applications in diverse as biohazard detection and
tumor recognition. Already there are groups around the world who have applied
specialized Terahertz techniques to disease diagnostics (1), recognition of
protein structural states (2), monitoring of receptor-bindings (3), performing
label-free DNA sequencing (4) and visualizing contrast in otherwise uniform
tissue (5). A commercial Terahertz imaging system has recently started tests in
a hospital environment (1) and high sensitivity imagers with deeper penetration
into tissue have begun to emerge (6). Solicitations for more
sophisticated instruments and enabling Terahertz components have
filtered into US agency proposals from DoD and NASA, to NSF and NIH, and many
research groups have sprung up, both in this country and in Europe and
* Contact LRW for references and expanded summary by Dr. Siegel
Committee MTT-5: Microwave High-Power Techniques
Committee Chair: Kiki Ikossi, Tel: 1-703-960-0261, e-mail: Ikossi@IEEE.Org
Vice Chair: Joe Qiu, Tel: 1-310-394-2532, e-mail: Joe.Qiu@IEEE.Org
Speaker:
Dr. Allen Katz
Tel: 609-584-8424
e-mail: a.katz@ieee.org
Topic (1): Minimizing Power Amplifier Memory Effects
Abstract: Memory effects are changes in an amplifiers non-linear characteristics resulting from the past history of the input signal. Predistortion linearization depends on a stable non-linear response, and can be significantly degraded by memory effects. This presentation will begin with an overview of linearization techniques and the application of digital signal processing (DSP) to the correction of distortion in power amplifiers. The problems caused by memory effects will be introduced, Different sources of memory effects will be discussed and techniques for their suppression presented.
Topic (2): Linearization: Reducing Distortion in Power Amplifiers
Abstract: Our Society's need to exchange greater and greater amounts of information has created an unprecedented demand for highly linear power amplifiers. High linearity is required for the spectrally efficient transmission of information. This presentation will discuss techniques for the cancellation of distortion that are also known as linearization. Different methods of linearization including digital approaches will be introduced and compared. The linearization of solid-state power amplifiers, traveling wave tubes amplifiers and klystron power amplifiers will be considered. Criteria for the evaluation of linearity will be reviewed and special attention given to problems unique to SSPAs.
Speaker:
Dr. James Komiak
Tel: 603-885-6910
e-mail: james.j.komiak@baesystems.com
Topic: Design and Performance of Microwave and Millimeter-wave High Efficiency Power Amplifiers
Abstract: Device technologies covered include SiBJT, MESFET, HBT, PHEMT, InP, MHEMT, and Wide Bandgap (SiC, GaN) Content includes principles of operation, structures, characteristics, and state of the art benchmarks. Power amplifiers utilizing these device technologies covering L-Band through W-Band are described including state of the art benchmarks.
Speaker:
Dr. F. M. Ghannouchi
Tel: 403-220-5807
e-mail: fghannouchi@ieee.org
Topic 1 RF/DSP Co-Designed Power Amplifiers/Transmitters for Advanced Wireless and Satellite Applications
Abstract: The wireless and satellite communications communities have always been looking for power- and spectrum-efficient amplification systems. The design of such power amplifiers has to be considered closely together with the system architecture in order to ensure optimal system level performances in terms of linearity and power efficiency. This implies the use of adequate transmitter's architectures that convert the analog base band information to architecture dependent amplifier driving signals such as sigma-delta, EE&R, and LINC architectures. This seminar lays out the principles behind the software enabled linear and highly efficient power amplifiers/transmitters sub-systems. Design and practical realization of RF/DSP co-designed transmitters for MC-CDMA and OFDM wireless applications will be presented.
Topic 2: Linearization: An Enabling Technology for 3G+ Systems
Abstract: This talk briefly presents the basic concepts of linearization technology as well as the reason why linearization is being considered as an enabling technology for 3G and beyond wireless communication systems, Included will be the description and explanation and how linearization favorably affects both spectrum and power efficiencies of transceivers and what are the devices the system based techniques available to the designer of nonlinear communication circuits and systems. Feedback, feed forward and predistortion based linearization techniques will be presented. Important and critical issues in designing these linearizers will be discussed in light of the broadband communications applications targeted either for handheld or base station terminals. Examples of analog, digital, or hybrid implementations will be presented and discussed.
Committee MTT-6: Microwave and Millimeter-Wave Integrated Circuits
Chair: Frank Sullivan, Tel: 978-440-2276, e-mail: f.sullivan@ieee.org , John Pierro, Tel: 631-439-9137, e-mail: jpierro@miteq.com
Speaker:
M. Madihian, NEC Corporation of
Tel: 609-951-2916
Fax: 609-951-2499
e-mail: Madihian@IEEE.Org
Topic: RF/Analog Circuit Design for Wireless Communication Networks
Abstract: Demand for wireless terminals with location-free multimedia services has urged development of low-cost low-noise low-distortion small-size front-end modules with switching. RF/IF amplification, synthesizers, and down/up conversion features. The lecture will cover design of amplifier, mixer, switch, oscillator, and frequency-doubler/divider building blocks using the optimum device technology. The lecture will also provide an understanding of S-parameters and their application to the circuit design.
Speaker:
Prof. Shiban K Koul, Indian Institute of Technology Delhi, India; Tel: +919811209829; Fax:: +91-11-26863165
e-mail: s.k.koul@ieee.org or shiban_koul@hotmail.com
Topic: Millimeter Wave Integrated Circuit Techniques and Technology
Abstract: Millimeter waves offer widespread applications in defense, space and commercial sectors. In this talk, different technologies for building Millimeter Wave Integrated Circuits and Subsystems will be presented. Starting from conventional microstrip technology, other key technologies including suspended stripline, dielectric integrated guide, finline, LTCC, MEMS, MMIC and polystrata will be described. Design methodology leading to development of several high performance components/ subsystems at 35 GHz, 60 GHz and 140 GHz along with experimental results will be presented. The talk will conclude by giving a comparison of various technologies.
Committee MTT-7: Microwave and
Committee Chair(s): Madhu S. Gupta, Tel: 619-594-7015, e-mail: m.gupta@ieee.org
Speaker: Contact Committee Chair
Committee MTT-8: Filters and Passive Components
Committee Chair: Sridhar Kanamaluru, Tel: 717-397-2777, Ext 3163, e-mail: skanamaluru@ieee.org
Vice Chair: Ming Yu, Tel: 519-622-2300, Ext 2503, e-mail: ming.yu@Comdev.ca
Speaker:
Dr. Chi Wang, Orbital Sciences Corporation
Tel: 703-948-8240
Fax: 703-948-8526
e-mail: chi.wang@ieee.org
Topic: Analysis and Design of Dielectric Resonators and Filters
Abstract: In 1939 R.D. Richtmyer first presented the concept of dielectric resonators (DRs). In 1960's Harrison and Cohn Presented TE 01+ mode resonator filter and its approximate analysis method. Starting from the properties of the dielectric resonator and Cohn's simple DR model, this presentation will give detailed information including DR's resonant modes and rigorous full wave modeling and design method. Basic types of DR and DR filters are presented. TE01 single-mode filters offer the advantages of design simplicity and flexibility in layout options over HE11 dual mode filters, while dual-mode filter has the significant advantages on the mass and volume of the products. Mixing the TE01 and HE11 modes dielectric loaded cavity in a filter can achieve excellent out of band spurious performance.
Speaker:
Dr. R.V. Snyder, RS Microwave
Tel: 973-492-1207
Fax: 973-492-2471
e-mail: r.snyder@ieee.org
Topic 1: Present and Future Filter Design Philosophy: Paradigm Shift in Progress
Abstract: The design of
passive filter networks has traditionally been a process in which
approximations are made to a desired transfer function using reactive and
resistive elements exhibiting the same frequency-dependent functional form.
Over the years, a variety of synthesis techniques have been developed that
allow for extracting sets of such elements from the transmission and reflection
functions associated with approximating the desired transfer function when
terminated with a specified source and load impedance. We know that physically
it is not difficult to combine lumped, distributed and evanescent elements in
the same network. Optimization allows for insertion of elements with different
frequency dependencies, but exact synthesis is generally not possible. This
presentation will address present approaches and will provide insight into
future design approaches.
Topic 2: Computing
and Enhancing Power Handling in Bandstop Filters
Abstract: Notch filters are increasingly important components in high power
communication systems. Cosite interference analog suppression techniques depend
heavily on eliminating emission of spurious high power signals at the source, or
suppressing such signals prior to a receiver. Understanding and enhancing the ability of notch filters to survive
exposure to high RF power is the subject of this presentation. The power handling capability of bandpass and lowpass filters has been studied and much published material is readily
available. However, bandstop
and highpass filters have not been
studied as thoroughly (or public results are not as easy to find). In this presentation, we will present the
basic computational basis for determining power handling and suggest methods
for increasing the breakdown and/or heat-related failure thresholds.
Speaker:
Prof. Vicente E. Boria-Esbert
Tel: +34 96 387 9718
(+34 656 357732)
Fax: +34 96 387 7309
e-mail: vboria@dcom.upv.es
Topic: Waveguide Filters
for Satellites
Abstract: An overview of
all-metal waveguide filters for satellite payloads is offered in this talk.
Initially, an historical evolution of this filtering technology, including
typical electrical and mechanical requirements, is outlined. Next, recent
advancements in full-wave analysis methods and automated design procedures of
these filters are reviewed. Then, a Computer-Aided Design (CAD) tool based on
such techniques (i.e. FEST3D "Full-Wave Electromagnetic Software Tool for
3D Waveguide Components") is introduced, and its practical application to
the analysis and design of several examples of satellite filters is presented.
In particular, direct-coupled rectangular waveguide filters, E-plane waveguide technology,
dual-mode filtering prototypes and evanescent mode waveguide filters are
considered. Classical topologies, as well as more novel configurations for each
filter class, are discussed.
Committee MTT-9: Digital Signal Processing
Committee Chair(s): Hermann Boss, Tel: 49-894-129-13606, e-mail: Hermann.boss@rohde-schwarz.com Y.K. Chen, Tel: 908-582-7956, e-mail: vkchen@lalcatel-lucent.com
Speaker:
Dr. James B.Y. Tsui, AFRL/SNRP,
Tel: 937-255-6127 x 4320
Fax: 937-255-7135
e-mail: tsuiijb@sensors.wpafb.af.mil
Topic: Digital RF Receivers
Abstract: A recent trend in building RF receivers is to use digital techniques to replace conventional analog approaches, since the digital approach can provide significant advantages. This task addresses the performance requirements of analog-to-digital converters in the receiver system, and several approaches for building wide and narrow band receivers.
Committee MTT-10: Biological Effects and Medical Applications
Committee Chair(s): Mohammad Tofighi, Tel: +1 215-895-1913 , e-mail: mtofighi@psu.edu
Vice Chair: Arye Rosen,
Tel: +1 717-948-6112, e-mail: arye.rosen@drexel.edu
Speaker: Dr. Peter Siegel, JPL, Pasadena, CA
Tel: 818-354-9087
e-mail: phs@caltech.edu
Topic: MTT-10 is Co-Sponsor of DR. Siegel's Talk with MTT-4. The Abstract is listed under MTT-4.
Committee MTT-11: Microwave Measurements
Committee Chair: Kate Remley, e-mail: remley@boulder.nist.gov
Speakers:
Dr. Jan Verspecht or Prof. Andrea Ferrero (both speakers deliver same talk)
J. Verspecht (Point of contact for this topic)
Tel: 32-479-85-59-39
e-mail: contact@janverspecht.com
Andrea Ferrero
Tel: 390115644082
e-mail: ferrero@polito.it
Topic: Non-Linear Measurement: From the Power Meter to the LSNA
Abstract: This presentation covers the most important aspect of Non-Linear microwave device characterization from the early beginning of power meters to the most advance instruments available today like e.g. the Large Signal Network Analyzers. The presentation deals with nonlinear characterization techniques for individual power transistors as well as for communication systems: fundamental and harmonic load-pull measurements, spectral regrowth measurements (ACRP), intermodulation measurements (IM3, IM5, ...), harmonic distortion analysis, error vector magnitude measurements and hot S-parameter techniques. Next to covering the broad topic of nonlinear microwave measurements, the audience will be educated on Large-Signal Network Analyser (LSNA) instruments that can accurately and completely characterize devices under realistic large signal operating conditions.
Speaker:
Michael D. Janezik, NIST, Boulder, CO
e-mail: janezic@boulder.nist.gov
Topic: High-Frequency Measurements of Dielectric Substrate Materials
Abstract: High Performance substrate materials are required for high frequency and wideband applications. In this presentation both transmission-line and resonant techniques for measuring the relative permittivity and loss tangent of dielectric substrates such as printed-circuit boards, printed-wiring boards and ceramic substrates over the 1 to 100 GHz. Transmission-line measurements include on-wafer material measurements using planar structures such as coplanar waveguides and microstrip transmission lines. Three resonant measurement techniques are overviewed including: the split-cylinder; split-post; and Fabry-Perot resonators. The presentation concludes with a discussions of the merits and limitations of each technique.
Speaker:
Dominique Schreurs, KU Leuven, Belgium
Dominique.schurers@kuleuven.be
Topic: Measurements for Modeling
Abstract: Models aimed for microwave and millimeter wave circuit design are typically based on measurements as opposed to physical simulations. The time needed to acquire the data often takes longer than the model extraction itself. The talk will focus on ways to render the characterization process more efficiently. A distinction is made between measurements for passive components and measurements for active devices and circuits. Issues such as propagation of calibration and de-embedding inaccuracies into model parameter extraction are addressed. By means of various examples, adaptive data collection and excitation design are covered. Finally, the optimal selection of measurements for thorough model validation will be elaborated upon.
Speaker:
Nick Ridler
National Physical Laboratory, UK
Tel: +44 20 8943 7116
Topic 1: All You Need to Know About RF & Microwave Coax Connectors But Were Afraid toAsk
Abstract: The humble coaxial connector has been a regular player in the high frequency electronics industry for the past fifty years or more. But it is this apparent familiarity, and apparent simplicity, that often leads to misunderstandings and mistakes with the use of connectors. This talk will give a review of coax connectors with an emphasis on how to get the most from any given connector. The talk begins with an historical overview of the evolution of the coax connector right up to the present day. The dos and don’ts of using connectors will also be addressed and how to select the best connector for a given application. Finally, some tips will be given on how to keep connectors in good health and how to ensure long connector life.
Topic 2: Evaluating Errors and Uncertainties in RF & Microwave Measurements
Abstract: This talk gives an overview of the principles and processes involved in dealing with errors in measurements, particularly at RF and microwave frequencies. The talk shows how the concept of uncertainty can be used to quantify the effects of errors that occur during measurements. The methods used to evaluate and express uncertainty are described and illustrated with some simple practical examples. The purpose of this talk is to enlighten rather than mystify the subject of dealing with error and uncertainty in measurement.
Speaker:
Stavros Iezekiel
University of Cyprus
iezekiel@ucy.ac.cy
Topic: Microwave Fiber-Optic Links: Design and Measurement Issues
Abstract: Optical fibre is an excellent transmission medium - it has very low loss and very large bandwidth (especially when compared with microwave transmission media). In addition, it is possible to modulate light at several tens of GHz and then recover that modulation. Hence there has been much interest in the use of optical fibre for the transmission and processing of RF signals.
In the first part of the talk, some of the basic design issues for analogue links will be discussed. In particular, the effect of component-to-component interaction on small-signal, large-signal and noise performance will be considered. It will be seen that it is useful to be able to model and measure the "microwave characteristics" of optoelectronic and optical components. In the second part of the talk, various techniques for the measurement of high-speed lightwave components will be outlined. The emphasis will be on extending microwave network analyser techniques to these devices. Issues associated with polarization effects, optical cavity resonances and nonlinearity will be discussed in some detail.
Committee MTT-12: Microwave and Millimeter-Wave Packaging
Committee Chair:
Chair:
Robert W. Jackson,
jackson@ecs.umass.edu <x-msg://43/jackson@ecs.umass.edu>
Vice Chair: Paul Garland,
paul.garland@kyocera.com <x-msg://43/paul.garland@kyocera.com>
Speaker:
Rick Sturdivant
President
Microwave Packaging
Technology, Inc.
Tel: 310-980-3039
Topic: T/R Modules Using 3D and SIP Packaging
Abstract: T/R modules have traditionally used metal housings with glassed-in interconnects and ceramic substrates. More recent approaches use 3D stacked substrates and the tile module approach. This approach resulted in lower cost, lower-profile and lighter-weight arrays. With advances in packaging materials and processes, System In a Package (SIP) approaches are being used for T/R modules. These approaches promise the realization of further cost reductions, large "membrane" arrays for space applications and improved array-level manufacturability. This presentation reviews traditional T/R module packaging, examines a tile module in detail, examines next generation T/R modules using SIP and array-level packaging approaches. The presentation concludes with a projection on future developments in phased arrays.
Speaker:
Anh-Vu Pham,
Tel: 530-752-7472
e-mail: pham@ece.ucdavis.edu
Topic: Liquid Crystal Polymer for RF and Millimeter Wave Multi-layer Packages and Modules
Abstract: We present the design and development of multi-layer organic modules and packages using liquid crystal polymer (LCP). An overview and unique properties of liquid crystal polymer will be discussed. We will present the development of adhesive process that bond LPC to LCP, Si, and printed circuit board materials. These processes are used to develop wafer-scale and surface mount packages for microwave and millimeter wave applications. We will present the electrical characteristics and package performance of wafer scale and surface mount packages up to Ka-band frequencies. Environmental test and evaluation of these packages will be discussed.
Committee MTT-13: Microwave Ferrites
Committee Chair(s):Steven Stitzer, Tel: 410-765-7348, e-mail: s.stitzer@ieee.org , William Alton, e-mail: billa@feriteinc.com
Speaker:
Dr. Charles R. Boyd Jr., Microwave Applications Group,
Santa Maria, CA, 93455
Tel: 805-928-5711
Fax: 805-925-5903
e-mail: crboyd@magsmx.com
Topic: Ferrite Phase Shifters
Abstract: Review of ferrite materials. Ferrite phase shifter types, characteristics, and selection criteria. Introduction to simple methods for analysis of phase shifter performance. Phase shifter control techniques. System applications in one- and two-dimensional electronically scanning phased-array antennas, circulating and reciprocal switches.
Committee MTT-14: Microwave Low-Noise Techniques
Committee Chair(s): Luciano Boglione, Tel: 617-661-8999, e-mail: L.Boglione@IEEE.Org ; Vice - Philip M. Smith, 603-885-6785, e-mail: Philip.M.Smith@BAESystems.Com
Speaker:
Dr. Marian Pospieszalski, Nat. Radio Astr. Lab.
Charlottesville, VA 22901
Tel: 434-296-0350
e-mail: mpospies@nrao.edu
Topic: Ultra Low Noise, InP Field Effect Transistors Radio Astronomy Receivers: State -of-the - Art
Abstract: Over the last quarter century progress in the noise performance of FET and HFET amplifiers at cryogenic temperatures was quite dramatic. The achievable noise temperatures at particular frequencies were lowered by an order of magnitude and the useful frequency range of cryogenic HFET receivers was extended by about an order of magnitude up to 120 GHz. The presentation will document the course of these developments with special emphasis on the following topics:
Noise and signal properties of heterostructure field effect transistors at cryogenic temperatures
Design and examples of realizations of wideband, low-noise, cryogenically-coolable HFET amplifiers in the 3 to 120 GHz range
Examples of realization of receivers for interferometric arrays
Examples of realization of very broadband continuum radiometers
Thoughts on future developments in low-noise amplifier technology and the possible new applications of this technology will be offered. A more detailed summary of this talk is available on request.
Speaker:
Dr. Francois Danneville
IEMN, URM CNRS 8520
59652 Villeneuve d'Ascq Cedex, France
Tel: 33-320197936
e-mail: Francois-Danneville@iemn.univlille1.fr
Topic: Noise Analysis in Field Transistors Operating Under Small or Large Signal Operation
Abstract: This talk covers the noise analysis in Field Transistors operating under small or large signal operation. In the first part, a linear distributed high frequency noise modeling for SOI MOSFET is used to discuss the noise sources in a macroscopic level (noise sources representing the noise of a FET as a two port). The trends for future technologic nodes when shrinking the MOSFETs dimensions are also discussed (influence of parasitic elements) as well as the influence of a DC tunneling gate current on the noise performance. In the second part noise properties of III-V HEMTs operating under large signal steady state are covered. The concept of Impedance Field used under linear conditions is extended to nonlinear conditions, allowing for a creation of CAD oriented nonlinear noise model of a FET. The model is then applied to the noise analysis of FET mixers. Also, it is shown how low frequency microscopic noise process (1/f noise, generation-recombination noise) are determining the phase noise in microwave circuits. A more detailed summary of this talk is available on request.
Committee MTT-15: Microwave Field Theory
Committee Chair(s): Peter Russer, Tel: 49-89-289-28390, e-mail: russer@tum.de , David Jackson, Tel: 713-743-4426, e-mail: djackson@uh.edu
Speaker: David R.
Jackson,
Tel: 713-743-4426
e-mail: djackson@uh.edu
Topic: Leaky Modes and High-Frequency Effects on Microwave Integrated Circuits
Abstract: This presentation will overview the propagation of leaky modes on planar microwave integrated circuit structures, including microstrip line, covered microstrip line, and stripline with an air gap. A leaky mode is a mode that leaks power as it propagates, with the leakage occurring into the modes of the surrounding substrate structure and in some cases also directly into space (for an open structure). The excitation of leaky modes on planar printed-circuit transmission lines leads to signal attenuation due to radiation, crosstalk, and interference effects (since the leaky modes can interfere with the desired mode of propagation). Methods for calculating the properties of these leaky modes will be presented, together with ways of predicting when these effects might occur. For an expanded version of this Abstract please contact Prof. Jackson.
Speaker: Prof. Peter Russer, Munich University of Technology
Tel: 49-89-289-28391
e-mail: ruser@tum.de
Topic: Geometrical Concepts in Teaching Electromagnetics
Abstract: This presentation deals with the application of exterior differential forms in teaching electro-magnetics. The formulation of electromagnetic theory can be simplified and the ability to create concepts can be improved by the use of geometrical methods. The exterior differential calculus establishes a direct connection to geometrical images and provides additional physical insight. Exterior differential calculus has simple and concise rules for computation. Furthermore, the objects of differential calculus have a clear geometric significance and the geometrical laws of electro-magnetics assume a simple and elegant form. Contact Prof. Russer for an expanded Abstract.
Speaker: Prof. Dr. Christopher Caloz;
École Polytechnique de Montréal
Department of Electrical Engineering
2500, ch. de Polytechnique
Montréal (Québec)
H3T 1J4, Canada
Tel.: +1 (514) 340-4711, ext. 3326
Topic: Metamaterials: Blue-Sky Chimera or Revolution in Microwaves and Photonics
Metamaterials, which are broadly defined as effectively homogeneous
electromagnetic structures exhibiting unusual properties – such as negative
refraction, sub-wavelength resolution, coupled-mode enhancement, infinite
wavelength propagation, zeroth-order resonance, full-space leaky-wave radiation
– have drawn huge interest in both the physics and engineering communities since
their first experimental demonstration in 2000.
As all novel ideas in science and technology, metamaterials have raised
considerable controversies, some believing that they represent a mode topic
restricted to academic studies, others seeing in them a revolutionary paradigm
for tomorrow's electrodynamics and optics.
This presentation attempts to address the question on the actuel potential of
metamaterials in a critical manner and tries to provide a vision of the future
directions of research and industrial developments in this field. First, it
shows that, in contrast to typical mode topics rediscovering ideas established
in the past or borrowing ideas from other fields without scientific grounds,
metamaterials are based on some fundamentally novel and useful concepts. Next,
it shows a number of practical microwave applications with superior performance
and/or functionality compared to prior state-of-the-art microwave engineering
solutions. Finally, it discusses the next generation of metamaterials in
connection with most recent micro and nanotechnologies.
Speaker: Prof. Dr. Wolfgang Hoefer
University of Victoria
Department of Electrical and Computer Engineering
P.O. Box 3055 STN CSC
Victoria, B.C. V8W 3P6, Canada
Tel.: +1 (250) 721-6030, Sec: -8821
E-Mail: WHoefer@ECE.UVIC.ca
Topic: Multi-Level Modeling for Complex Microwave/High-Speed Design
Complex communication and information
systems operating in the Gigahertz range often combine multiple analog and
digital functions. The design of such systems must capture all electromagnetic
effects and interactions that impact their performance. However, it is
impossible to model such systems globally at the field and device levels.
Therefore, designers must take a hierarchical approach (top-down design) by
which the system is conceived at a high level of abstraction and in behavioral
terms. The specifications for its functional components are formulated at the
network or circuit level. They, in turn, define a physical structure that
requires frequency- or time-domain electromagnetic field analysis. Once the
functional components have been realized, their actual physical behavior must be
analyzed or measured, including possible parasitic
interactions between them, and abstracted into realistic (as opposed to
initially specified) behavioral models that accurately predict their impact on
overall system performance (bottom-up verification). This methodology also
addresses signal integrity, packaging, interconnects, electromagnetic
compatibility (EMC), and thermal issues.
The purpose of this lecture is to familiarize our members with evolving design
approaches for systems of large technological and functional complexity, and to
demonstrate how microwave modeling and design practices can be integrated into a
wider flexible multi-level modeling environment. Techniques for interfacing
models at the behavioral, network, circuit and field levels will be
demonstrated. They range from order reduction of field models to the coupling of
field- and circuit solvers, extraction of equivalent circuits from field
solutions and measurements, behavioral representation by neural networks, and
the linking of electromagnetic and thermal solvers. The key is to describe
different parts of a complex structure by the most appropriate model of lowest
possible order, while maintaining a two-way correspondence between functional
behavior and physics across the modeling hierarchy.
Speaker: Prof. Zhizhang (David) Chen
Dalhousie University
Department of Electrical and Computer Engineering
1360 Barrington St.
Halifax, Nova Scotia
Canada B3J 2X4
Tel.: +1 (902) 494-6042, Secretary: -3996
E-Mail: z.chen@dal.ca
Web: http://myweb.dal.ca/zdchen/
Topic: Unification of Numerical Methods: A General Mathematical Framework for Derivations and New Scheme Developments
Electromagnetic field modeling and simulation have become increasingly popular for accurate designs in modern electrical and electronic engineering, thanks to the drastic advances in computer technology. They have been applied in many areas, in particular in industrial designs where the reduction in the number of design cycles or product's time-to-market has become very critical in a global competitive environment. For instance, in antennas, most of the practical designs are now done with simulations using commercially available software packages before actual prototyping and testing. In high-frequency electronic circuits, due to the fact that analyses based on simple circuit theory are no longer adequate, electromagnetic simulators are increasingly being used to improve design accuracy. In biomedical engineering, numerical simulations are often required to compute dosimetry in a biological body since an actual measurement is either difficult or impossible.
Many numerical methods have been developed so far for electromagnetic modeling
and simulation. They present different approaches to the approximate solutions
of the electromagnetic field governing equations, namely, Maxwell's equations.
They include frequency-domain methods such as the finite-difference
frequency-domain (FDFD) method, finite-element (FEM) method and the conventional
method of moments (MoM), and the time domain methods such as finite-difference
time-domain (FDTD) method, transmission-line-matrix (TLM) method, time-domain
finite-element (TD-FEM) method, and time-domain integral formulations. On one
hand, these methods have been proven to be effective in solving electromagnetic
structure problems with their respective advantages and disadvantages. On the
other hand, they appear to have been derived on different mathematical bases and
their solution procedures also appear to be different from each other,
presenting challenges and difficulty for students, beginners and even
practitioners in understanding and applying them.
This lecture is intended to show otherwise: all the numerical methods can be
generalized or derived with the method of the weighted residuals, or method of
moments; As the result, an easy way to understand and apply numerical methods is
presented and a new perspective on numerical methods and a new way to develop
innovative numerical methods are shown. In particular, unifying concepts among
numerical methods are described and based on the concepts emerging numerical
methods such as meshless, hybrid and multilevel techniques are demonstrated.
Committee MTT-16: Microwave Systems
Committee Chair(s): Gregory Lyons, Tel: 781-981-4705, e-mail: g.lyons@ieee.org , Reinhard Knoechel, Tel: 49-431-880-6150, e-mail: rk@tf.uni-kiel.de
Speaker:
Dr. Roger Kaul.
Tel: 410-552-5289
Fax: 301-394-2525
e-mail: rkaul@ieee.org
Topic: Receiver Protectors for Intense EM Fields
Abstract: Land sea and airborne microwave receivers will experience increasing levels on intense electromagnetic fields. This presentation describes the current state-of-the-art in gaseous and solid-state receiver protectors, and projects future developments.
Speaker:
Dr. Christopher P. Silva
The Aerospace Corporation
El Segundo, California
Tel: 310-336-7597
Fax: 310-336-0620
e-mail: chris.p.silva@aero.org
Topic: State-of-the-Art Time-Domain Measurement and Modeling Techniques for Nonlinear Components and Systems
Abstract: This presentation introduces and describes new and highly accurate time-domain measurement and modeling techniques applicable to nonlinear communications components and systems with bandwidths ranging to several GHz. An overview and comparison of time-domain versus frequency-domain measurements as they pertain to nonlinear components and systems will first be given. The development of baseband time-domain measurement techniques and system will next be covered that provides state-of-the-art measurement accuracies of time-domain waveforms critical to design verification, model construction/validation with operational modulated signals, and system troubleshooting. A survey of some common frequency-domain blackbox modeling approaches will then be described, followed by the introduction of a new systematic approach, called the poly-spectral method, that is based on the time-domain input/output measurements involving operational modulated signals. A more detailed summary of this talk is available upon request.
Speaker:
Bruce Kopp
DPM Consulting
410-992-4278
Topic: Transmit/Receive Modules for Phased Array Antennas
Abstract:
Phased array antennas provide a significant improvement in revisit rate in comparison
to mechanically rotated antennas. This is of particular importance for RADAR
applications, and phased array antennas are typically
utilized for high performance RADAR applications of current interest.
Transmit/receive (T/R) modules play a significant role in determining the
performance, reliability, and cost of a phased array antenna. T/R modules also
encompass a diverse set of technologies including semiconductors, packaging,
and automated assembly and also present significant
technical challenges. This presentation will discuss performance, cost, and
reliability challenges associated with T/R modules along with associated
emerging technologies.
Speaker:
Reinhard Knoechel
Technische Fakultat
Germany
49-431-880-6150
Topic: Microwave Sensors for Industrial Applicattions
Abstract: Microwave sensors find a continuously increasing number of applications for in-line sensing of materials properties and industrial process control. The first part of the talk will focus on the implantation of the latest two-parameter microwave sensors for the rapid determination of material properties. Two classes of two-parameter sensors will be presented. In the second part of the talk multi-parameter sensors will be introduced. With such sensors, dielectric spectra of materials are interrogated over wide frequency ranges at distinct spot frequencies. The most advanced sensors of the latter kind working either in frequency domain or in time domain, and based on ultra-wideband (UWB) bandwidths, will be shown and special applications will be presented.
Speaker:
Arne F. Jacob
Tel:
+49-40-42878-3019
Fax: +49-40-42878-2755
Topic: Integrated Millimeter-Wave (Sub-) Systems for Future Satellite Communications
Abstract:
The
advent of Ka-band satellites for broadband mobile communications calls for advanced
system architectures, technologies, and designs for both the ground and the
satellite segment. In its first part the presentation
addresses the particular challenges associated with the realization of compact millimeter-wave terminal antenna systems relying on
digital beam forming. The second part deals with the integration and the space
qualification of various on-board (sub-)systems using
advanced 2.5D (LTCC) packaging technologies.
Committee 17: HF/VHF/UHF Technology
Committee Chair(s): Richard Campbell, Tel: 503-601-1916, e-mail: kk76@ieee.org , Vice Chair: John Walker, Tel: 44-1455-556565, e-mail: jwalker@semelab.co.uk
Speaker:
Prof. Jozef W. Modelski, Inst. Of Radioelectronics,
Tel: 48-22-8253929 or 48-22-8256555
Fax: 48-22-8255248 or 48-22-8256555
e-mail: j.modelski@ire.pw.edu.pl
Topic: Microwave Phase Modulators and Shifters
Abstract: This lecture presents an overview of digital and continuous phase modulators and shifters with semiconductor (varactor diodes, pin diodes, FETs) and ferrite elements. Design methods and optimization procedures of different shifter structures for receiving: maximum shifter bandwidth, minimum parasitic amplitude modulation, high efficiency, maximum linearity of phase characteristics (for analog phase shifters) are given, particularly, for varactor diode analog and pin diode digital modulators. Practical realizations in different technologies and in different frequency bands are also presented
Speaker:
T. Boles, M/A COM Semiconductor Business Unit
Tel: 781-564-3386
Fax: 781-564-3141
e-mail: bolest@amp.com
Topic 1: A Fully Monolithic HMIC Low Noise Amplifier
Abstract: A two/three
stage monolithic silicon low noise amplifier has been designed utilizing SPICE
modeling techniques. The circuit design architecture is based on high
frequency, small signal BJT's, consisting of a common
emitter stage at the input and a
This paper will also cover the techniques and technology required to fabricate these monolithic high frequency circuits.
Topic 2: Design of
Abstract: In many wireless and CATV applications, the use of silicon MMIC gain blocks have replaced discrete devices for low level gain stages and medium power amplification. The gain blocks have become quite cost competitive in volume when compared with the discrete transistors and have the advantage of providing flat power gain while being matched to the required circuit impedances. Design concepts are presented.
Speaker:
Dr. R. Caverly,
Tel: 610-519-5660
Fax: 610-519-4436
e-mail: r.caverly@ieee.org
Topic: RF and Microwave Solid-State Control
Abstract: A variety of semiconductor technologies is now available for RF and microwave control. This talk will address such control technologies as PIN diodes and FET-based elements and issues related to the choice of control technology for particular applications. Control design considerations will also be discussed.
Speaker:
Tel: 44-0-1460-234296
Fax: 44-0-1460-234296
e-mail: Steve.Cripps@BTInternet.com
Topic: High Efficiency Amplification of Variable Envelope Signals for Modern Wireless Communications Systems: Doherty and Chireix Re-Visited
Abstract: Modern wireless systems pose severe challenges for the RF PA designer, both at the mobile end, where efficiency is paramount, and at basestation, which may require multi-channel operation. Most systems use phase-shift modulation but usually have accompanying envelope variations in order to limit channel bandwidth. This talk will review the basic theory of the Doherty technique and the Chireix outphasing method for designing such future systems.
Speaker:
Dr. F.H. Raab,
Tel: 802-655-9670
Fax: 802-655-9760
e-mail: f.raab@ieee.org
Topic 1: High-Efficiency RF-Power Amplifiers
Abstract: This talk is an overview of techniques for high-efficiency RF power amplification. First, some basic concepts about transistors and the concept of average efficiency are introduced. The characteristics of conventional amplifiers (classes A, B, and C) are then reviewed. The principles, demonstrated achievements, and practical limitations of RF-power amplifiers operating in class D, class E, and class F are then discussed. The talk concludes with a discussion of techniques for linear amplification using high-level amplitude modulation via a class-S modulator and the Kahn envelope-elimination and restoration technique.
Topic 2: Kahn-Technique Transmitters
Abstract: The Kahn envelope-elimination and restoration (EER) technique allows efficient but nonlinear RF amplifiers to be used to implement a high-efficiency linear transmitter. Fundamentally, a narrowband RF signal is regarded as simultaneous amplitude and phase modulation. The phase-modulated carrier is amplified efficiently by a chain of nonlinear RF amplifiers and the envelope is restored by high-level amplitude modulation of the final amplifier. This talk reviews the concept of average efficiency and then reviews the principles and requirements for the EER technique.
Topic 3: Low-Cost High-Efficiency HF Power Amplifiers
Abstract: Recently marketed "low-cost" RF-power MOSFETs in plastic TO-247 packages are capable of generating significant RF power at high efficiency in single-frequency RF applications. This paper explores the use of these MOSFETs in broadband power amplifiers. PAs operating in classes D, DE, and E are compared.
Speaker:
N.O. Sokal, Design Automation, Inc.
Tel: 781-862-8998
Fax: 781-862-3769
e-mail: nathan.sokal@compuserve.com
Topic 1: One (1) hour talk "Class E Switching-Mode High-Efficiency Power Amplifiers - from RF to Microwave"
Abstract: Class E power amplifiers achieve significantly higher efficiency than for conventional Class B or C. Class E operates the transistor as an on/off switch and "shapes the voltage and current waveforms" to prevent simultaneous high voltage and high current in the transistor; that minimizes the power dissipation, especially during the switching transitions. In the published low-order class-E circuit, a transistor performs well at frequencies up to about 70% of its frequency of good class-B operation.
Topic 2: Four (4) hour Tutorial Lecture "RF Power Amplifiers, Class A through S - How They Operate, and When to Use Each"
Abstract: With at least ten lettered classes of RF power amplifiers, and several combinations of these classes, many engineers are confused about RF power amplifiers. The complexity of the subject is compounded by the fact that RF power transistor acts either as a high-resistance current source or as a low-resistance switch, or - in some amplifiers - as a high-resistance current source during part of the "on" interval and as a low-resistance switch during another part of the "on" interval (mixed-mode operation). The circuit topology does not define unambiguously the transistor operating mode or the amplifier class of operation.
Committee MTT-18: Microwave Superconductivity
Committee Chair(s): Jeffrey Pond, Tel 202-767-2862, e-mail: j.m.pond@ieee.org , Charles Wilker, Tel: 302-499-5015, e-mail: charles.wilker@usa.dupont.com
Speaker: Contact Committee Chairs
Committee MTT-19: Microwave Technology Business Issues
Committee Chair(s): Ferdo Ivanek, Tel: 650-329-8716, e-mail: ivanek@stanford.edu
Speaker: Dr. Mike Golio
Editor-in-chief, IEEE Microwave Magazine
Tel: 480-615-6990
e-mail: m.golio@ieee.org
Topic: Engineering Your Retirement
Abstract: Engineering Your Retirement is designed to help technical professionals (engineers and scientists) develop a plan for their safe and successful retirement. The presentation examines important questions such as, "How much money will I need to retire?," "How long will it take for me to accumulate it?," and many others. The audience will be informed of free tools and information needed for someone to answer those questions and to achieve a comfortable retirement on their own schedule. Issues that must be considered to achieve a successful retirement including health care, budgeting, inflation, portfolio requirements, investment allocations, selecting a place to live, mortgage payoff, wills, powers of attorney, etc. are examined.
Committee MTT-20: Wireless Communication
Committee Chair(s): Upkar Dhaliwal, Tel: 858-926-5839, e-mail: upkar@ieee.org, Vice-Chair: Edward Niehenke, Tel: 410-796-5866, E-mail: e.niehenke@ieee.org
Speaker:
Dr. Rainee N. Simons, NASA Gleen Research Center Dynacs Group
Tel: 216-433-3462
Fax:216-433-8705
e-mail: Rainee.N.Simons@grc.nasa.gov
Topic: Recent Advances in Printed Antennas for Wireless and Satellite Communications
Abstract: The talk commences with a brief overview of printed antenna concepts. The overview would include basic types of printed radiators, such as, microstrip patch, strip, and slot antennas. Second, feeding techniques, such as, direct feed, proximity feed and aperture coupled feed will be discussed. Examples of feed systems using microstrip, slotline or coplanar waveguide will be presented. Third, techniques to realize dual polarization and polarization will be presented.
Committee Chair(s): Thomas Weller. e-mail: weller@eng.usf.edu , Scott Barker, e-mail: barker@virginia.edu
Speaker:
Dr. J. Robert Reid, Antenna Technology Branch, Air Force Research Laboratory
Hanscom AFB, MA 01731
Tel: (781) 377-1077
Fax: (781) 377-1074
email: James.Reid@hanscom.af.mil
Topic: Three Dimensional Millimeter Wave Circuits
Abstract:: This presentation covers the design and realization of microwave and millimeter-wave circuits using three dimensional metal micro-machining processes. Circuits fabricated using these process have several advantages over competing technologies. One particularly important advantage is the ability to realize TEM transmission lines that operate from DC to over 300 GHz and can be arbitrarily routed on a substrate. These lines are fully enclosed providing high isolation even at millimeter wave frequencies. A second advantage is the ability to accurately reproduce a wide variety of circuits including couplers and filters. Topics covered in this presentation will include the fabrication processes, circuit design and implementation, and the advantages and disadvantages of this new technology.
Speaker:
Dr. Ronald G. Polcawich, US Army Research Laboratory,
Tel: 301-394-1275
e-mail: rpolcawich@arl.army.mil
Topic: RF MEMS Devices Using Piezoelectric Thin Films
Abstract: Piezoelectricity is an extremely important physical phenomenon and in ceramic form has been widely used in sensors, actuators, and transducers. Piezoelectric thin film applications have been limited in the past with a majority of efforts emphasizing lower performance materials such as ZnO and AlN because of their ability to be easily integrated with standard microelectronics fabrication. However, a special class of functional materials, ferroelectrics, possesses a tremendous potential in new MEMS devices and has seen increasing research interest in recent years. Of particular interest is the use of lead zirconate titanate (PZT) thin films for actuators. Recently, PZT actuators have been successfully integrated to yield RF MEMS switches capable of operating at less than 10 volts.
Speaker:
N. Scott Barker,
e-mail: barker@virginia.edu
Tel: 434-924-6783
Topic: Distributed RF-MEMS Circuits
Abstract: In order to reduce the packaging requirements for RF-MEMS devices we have developed a switched capacitor technology with minimal contact. Although this switched capacitor design results in a reduced capacitance ratio in the range of 5-10 we have also developed circuit designs for phase shifters and tunable matching networks (and the same can be done with filters) which do not require a capacitance ratio over 10. In addition to packaging, another Achilles' heel for RF-MEMS has been the uncertainty in pull-down voltages due to residual stress that is built into the beam during fabrication. We have successfully identified the major contribution of this stress to thin-film gold beams and are now able to routinely fabricate thin-film (< 1 micron thick) gold cantilevers with almost zero tip deflection upon release, and fixed-fixed beams with a pull-down voltage that nearly matches the analytical model without the need for adding on an unknown stress term.
Speaker:
Prof. Shiban K Koul, Indian Institute of Technology Delhi, India; Tel: +919811209829; Fax:: +91-11-26863165
e-mail: s.k.koul@ieee.org or shiban_koul@hotmail.com
Topic: Micromachined Microwave and Millimeter Wave Circuit Design
Abstract: Micromachining has been applied to microwave and millimeter wave field to create low loss and high performance passive/active components and antennas. In this talk, starting from Modeling of transmission lines and discontinuities, design procedure to realize passive components will be presented. Next, design, modeling and fabrication of different types of micromachined antennas will be described. Methodology for the design, development and fabrication of RF MEMS switches on GaAs will then be presented. The schemes for developing reconfigurable RF MEMS circuits using either variable capacitors or RF MEMS switches will be discussed. The reconfigurable circuits include: a band pass filter, band stop filter, high isolation switch and a patch antenna.
Committee MTT-22: Signal Generation and Frequency Conversion
Committee Chair(s): Edmar Camargo, Tel: +1 408-580-7724, e-mail: E.Camargo@GMail.com, or ecamargo@ieee.org
Carlos Saavedra, Tel +1 613-533-2807, e-mail: Carlos.Saavedra@QueensU.Ca
Speaker: Contact Committee Chair
Committee Chair(s): Natalino Camilleri, Tel: 408-252-6165, e-mail: natalinoc@yahoo.com
Speaker: Contact Committee Chair
Committee MTT-24: RFID TECHNOLOGIES
Committee Chair: Manos Tantzeris, Tel: 404-385-6006, e-mail: etentze@ece.gatech.edu
Speaker:
Manos M. Tentzeris
Professor, School of ECE
Georgia Institute of Technology
Atlanta, GA 30332-250
Phone: 404-385-6006 , FAX : 404-894-0222
Homepage:
http://www.ece.gatech.edu/~etentze
Topic: Inkjet-Printed Electronics
Abstract: In this talk, inkjet-printed UHF and microwave circuits fabricated on paper substrates are investigated for the first time as an approach that aims for a system-level solution for fast and ultra-low-cost mass production. First, the RF characteristics of the paper substrate are presented by using the microstrip ring resonator in order to characterize the relative permittivity and loss tangent of the substrate at the UHF band for the first time reported. A UHF RFID tag module is then developed with the inkjet-printing technology, proving this approach could function as an enabling technology for much simpler and faster fabrication on/in paper. Simulation and well-agreed measurement results, which show very good agreement, verify a good performance of the tag module. In addition, the possibility of multilayer RF structures on a paper substrate is explored, and a multilayer patch-resonator bandpass filter demonstrates the feasibility of ultra-low-cost 3-D paper-on-paper RF/wireless structures. Various examples of inkjet-printed nanostructures (e.g. CNT's) on paper as well as benchmarking with other flexible materials (e.g., LCP) will conclude the talk.
(Jointly sponsored by MTT-S and EuMA)
|
Lecturer |
Lecture Title |
Lecturer e-mail |
|
Ovidio Bucci |
Electromagnetic inverse problems: quantifying, qualifying and retrieving the available information. |
bucci@unina.it |
| Peter Russer |
Network Methods in Electromagnetic Field Computation |
Russer@tum.de |
| Sergei Tretyakov |
Possibilities of Cloaking and Invisibility at Microwaves |
Sergei.Tretyakov@tkk.fi |
Lecture: Electromagnetic inverse problems: quantifying, qualifying and retrieving the available information.
Speaker: Ovidio Bucci, Professor of Electromagnetic Fields, Faculty of Engineering, University of Naples Federico II, bucci@ina.it
Abstract: Electromagnetic inverse problems occurs in many branches of applied science, as, f. i., antenna design and diagnostics, non-destructive testing, underground and intra-walls detection, biomedical diagnostics and so on. By their very nature, these problems are usually ill-posed and often non-linear, which makesthe development of effective and reliable inversion algorithms a very hard task. To face this task in a sound way, a necessary prerequisite is to answer the following points:
The lecture is mainly dedicated to answer, under a general setting, the first two points, taking into account the incompleteness and inaccuracy of any real measurement process. However, in the final part, some recent approaches to the last point are presented and open problems and possible pathways are briefly discussed.
Lecture: Network Methods in Electromagnetic Field Computation
Speaker: Peter Russer, Professor, Head of the Institute for High Frequency Engineering, Munich University of Technology,
Arcisstrasse 21, Munich D-80333, Germany, Russer@tum.de
Abstract:
With increasing bandwidths and
data rates of modern electronic circuits and systems, electromagnetic wave
phenomena that in the past were in the domain
of the microwave engineer, are now becoming pivotal in the design of analog and
digital systems. Design, modeling and optimization of high-speed analog and digital electronic
circuits and systems, photonic devices and systems, of antenna, radar, imaging
and communications systems, among other applications, require the application
of advanced tools in computational electromagnetics.
Compared with a network-oriented design a field-oriented design of circuits and systems requires
a tremendously higher computational effort. The availability of steadily increasing
computing facilities has not reduced the demand for efficient methods of
electromagnetic field computation. This is readily understandable especially in the highly
competitive design of broadband and high-speed electronic components. The
demands for volume, weight and cost reduction foster a compact and complex design of
electromagnetic structures yielding a high computational effort in
electromagnetic modeling.
Network-oriented methods
applied to electromagnetic field problems may contribute significantly to the
problem formulation and solution methodology. Whereas in field theory the
three-dimensional geometric structure of the electromagnetic field has to be
considered, a network model exhibits a plain topological structure. Network models relate
integral quantities like voltage and current, which at lower frequencies, can be
defined uniquely by line integralsover electric and magnetic field quantities. An
essential point is that network models can also apply to electromagnetic
structures at higher frequencies when generalized voltages and currents are
introduced by a proper definition of integral field quantities. One particular
example of thisnprocedure realized in Method of Moments (MoM) where the coefficients of the
expansions of electric and magnetic fields can be considered as generalized
voltages andcurrents and the linear equations relating these quantities as network
equations.
In network theory systematic
approaches for circuit analysis are based on the separation of the circuit into
the connection circuit and the circuit elements. The connection circuit
represents the topological structure of the circuit and contains only
interconnects, including ideal transformers. Applying a network description
electromagnetic structures can be segmented into substructures. These
substructures define the circuit elements and the set of boundary surfaces
between the substructures define the
interconnection network. Canonical Foster equivalent circuits can represent lossless structures in sub-domains. Canonical Cauer networks can describe radiation modes.
The lumped element models can be obtained by analytic methods, i.e. via Green's function or mode matching approaches or by numerical methods
techniques (Transmission Line Matrix Method or Transverse Wave Formulation) in connection with system identification techniques.
The network approach allows a
systematic introduction of hybrid methods. Furthermore, network formulations are
well suited for the application of model order reduction methods.
Analytic and numerical methods and examples of their application are discussed.
Network methods are applicable in connection with the main analytic and numerical
methods for electromagnetic field modeling and provide a large variety of tools
for efficient modeling of complex electromagnetic structures.
Lecture: Possibilities of Cloaking and Invisibility at Microwaves
Speaker: Sergei Tretyakov, Professor of Radio Engineering, Helsinki University of Technology (TKK), Sergei.Tretyakov@tkk.fi
Abstract: Recently, the topic of making objects "invisible" for electromagnetic radiation has gained much attention, following new ideas of using engineered electromagnetic materials with unusual properties for this purpose. This lecture provides a comparative review of the recent developments in this field and discusses the potentials of utilizing these ideas for various microwave and antenna applications. The lecture starts from a review of the notions of invisibility and cloaking and their relations to the classical stealth technologies of reducing radar cross section of targets. Next, we make a historical overview of earlier approaches to techniques allowing reduction of scattering from various objects. Recently proposed solutions for cloaking of objects are reviewed and compared, with the emphasis on the fundamental limitations of their performance. This topic is closely linked to the problem of creating of artificial materials with engineered electromagnetic properties. In particular, materials with equal values of relative permittivity and permeability are of interest. The lecture presents our recent developments of such materials based on mixtures of spiral inclusions and their use for cloaking applications. Furthermore, we discuss the use of electrically dense meshes of transmission lines as cloaking devices. It is shown how new cloaking techniques can be used for applications not necessarily related to cloaking of objects, for instance in new microwave lens antennas or in the design of matched absorbing layers.
Reimbursement for Speakers Bureau Expenses (Control-Home to return to top)
END